Advanced Packaging
Wafer Level Packaging and System-In-Package
In electronics manufacturing, integrated circuit (IC) packaging is the final stage of semiconductor device fabrication. The integrated circuit is encapsulated in a supporting case, known as a “package”, which supports the electrical contacts which connect the device to a circuit board.
The huge variety of ICs in the semiconductor industry all have different packaging requirements: The package type for a particular device depends on different parameters including size, power dissipation, field-operating conditions, and cost. Advanced packaging technologies include BGA, Flip-Chip, CSP, LGA, and PGA.
Multi-chip modules, systems-in-package, as well as heterogeneous integration of dissimilar chips or sensors allow higher integration densities compared to multiple chips on a conventional printed circuit board (PCB). These packages offer advantages in terms of speed, cost, functionality, and ease of integration for system designers.
Depending on packaging method and the technical requirements, different materials need to be structured to implement the required fan out and mapping of the IC contact pads. The materials range from silicon (through-silicon vias) to polymers to ceramics to metals.
What these all have in common is the requirement for a flexible and high-resolution lithography technology. Heidelberg Instruments’ VPG+ systems are designed for flexible production applications and offer high throughput, automatic distortion compensation, and focus following for substrates with low planarity.
High area throughput reduces production time and cost; high availability and reliability must be guaranteed to maximize uptime
High resolution (1 - 2 µm) for devices and back-end processes
High CD uniformity and high alignment accuracy to ensure and optimize device uniformity and yield
Flexible substrate materials, thicknesses, and sizes are required depending on the packaged devices and application
Automatic distortion correction is required to compensate for distortions introduced by the substrate material and the bonded devices
Simultaneous exposure
Fast setup time & flexibility
Automatic distortion correction
Field-proven technology
Application images
Systems
VPG+ 200/400
- Volume Pattern Generator
A production tool for standard photomasks and microstructures in i-line resists.
VPG+ 800/1100/1400
- Volume Pattern Generator
Photomask production on large substrates, perfect for display applications.