ULTRA

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Designed to produce mature semiconductor photomasks

  • Product Description

  • The ULTRA is a qualified laser mask writer specifically for mature semiconductor photomasks. Semiconductor photomasks are used to fabricate electronic devices including microcontrollers, power management, LED, Internet of Things (IoT) and MEMS.

    The ULTRA is an economical mask writer solution with all the features and functionality required for high throughput, precision and structure uniformity, and extremely accurate alignment. The standard configuration includes features like full automatic mask handling, Zerodur® stage, low distortion optics and high-precision position control.
    ULTRA systems can produce structure sizes down to 500 nm at write speeds up 580 mm2 per minute, while featuring excellent critical dimension uniformity, image quality, overlay and registration. As a compact system, it fits easily into the existing mask shop infrastructure.

    The ULTRA is a qualified laser mask writer specifically for mature semiconductor photomasks. Semiconductor photomasks are used to fabricate electronic devices including microcontrollers, power management, LED, Internet of Things (IoT) and MEMS.

    The ULTRA is an economical mask writer solution with all the features and functionality required for high throughput, precision and structure uniformity, and extremely accurate alignment. The standard configuration includes features like full automatic mask handling, Zerodur® stage, low distortion optics and high-precision position control.
    ULTRA systems can produce structure sizes down to 500 nm at write speeds up 580 mm2 per minute, while featuring excellent critical dimension uniformity, image quality, overlay and registration. As a compact system, it fits easily into the existing mask shop infrastructure.

  • Product Highlights

  • High Exposure Quality

    Custom High NA write lens and low distortion UV-optics

    High Precision

    Full air-bearing stage; zero thermal expansion ZERODUR® chuck; high resolution differential interferometer; stage corrections and tool matching functions

    High Throughput

    Fast SLM based exposure engine; fast mode; 6“ write time below 45 minutes

  • Available Modules

The ULTRA is a qualified laser mask writer specifically for mature semiconductor photomasks. Semiconductor photomasks are used to fabricate electronic devices including microcontrollers, power management, LED, Internet of Things (IoT) and MEMS.

The ULTRA is an economical mask writer solution with all the features and functionality required for high throughput, precision and structure uniformity, and extremely accurate alignment. The standard configuration includes features like full automatic mask handling, Zerodur® stage, low distortion optics and high-precision position control.
ULTRA systems can produce structure sizes down to 500 nm at write speeds up 580 mm2 per minute, while featuring excellent critical dimension uniformity, image quality, overlay and registration. As a compact system, it fits easily into the existing mask shop infrastructure.

The ULTRA is a qualified laser mask writer specifically for mature semiconductor photomasks. Semiconductor photomasks are used to fabricate electronic devices including microcontrollers, power management, LED, Internet of Things (IoT) and MEMS.

The ULTRA is an economical mask writer solution with all the features and functionality required for high throughput, precision and structure uniformity, and extremely accurate alignment. The standard configuration includes features like full automatic mask handling, Zerodur® stage, low distortion optics and high-precision position control.
ULTRA systems can produce structure sizes down to 500 nm at write speeds up 580 mm2 per minute, while featuring excellent critical dimension uniformity, image quality, overlay and registration. As a compact system, it fits easily into the existing mask shop infrastructure.

High Exposure Quality

Custom High NA write lens and low distortion UV-optics

High Precision

Full air-bearing stage; zero thermal expansion ZERODUR® chuck; high resolution differential interferometer; stage corrections and tool matching functions

High Throughput

Fast SLM based exposure engine; fast mode; 6“ write time below 45 minutes

Customer applications

The ULTRA’s data path has been designed to be able to handle even complex geometries and dense patterns while upholding high exposure speed – even round or circular features can be written easily. The image shows circles (Ø 5 µm) etched in chrome with a line width of 600 nm.
The ULTRA’s data path has been designed to be able to handle even complex geometries and dense patterns while upholding high exposure speed – even round or circular features can be written easily. The image shows circles (Ø 5 µm) etched in chrome with a line width of 600 nm.
This optical microscope image shows a structure etched in chrome with a line width of 700 nm.
This optical microscope image shows a structure etched in chrome with a line width of 700 nm.
Regular structure showing unifomity etched in chrome (line width 1 μm). Optical microscope image with a top illumination.
Regular structure showing unifomity etched in chrome (line width 1 μm). Optical microscope image with a top illumination.
The image shows 500 nm tilted lines and spaces; a key element of major relevance to many applications like processors, printed circuits, and structures in photonics, for example optical grids.
The image shows 500 nm tilted lines and spaces; a key element of major relevance to many applications like processors, printed circuits, and structures in photonics, for example optical grids.
500 nm holes with high density in IP3250 resist on Si Wafer. Uniformity of the exposure.
500 nm holes with high density in IP3250 resist on Si Wafer. Uniformity of the exposure.
SEM image of a waveguide pattern exposed in a 550 nm thick positive resist showing nice smooth edges and sharp vertical walls. (Courtesy of IMS Chips)
SEM image of a waveguide pattern exposed in a 550 nm thick positive resist showing nice smooth edges and sharp vertical walls. (Courtesy of IMS Chips)

Technical Data

QX modeFX mode
Writing performance
Address grid [nm]410
Line edge roughness [3σ, nm]2040
Position accuracy [3σ, nm]40100
Overlay [3σ, nm]3060
Stitching [3σ, nm]2060
2nd layer alignment [max error / nm]100100
CD uniformity [3σ, nm]3060
Minimum feature size [nm]500700
Write speed [mm² / min]325580
Write time for 6″ x 6″ [min]7545
Operation
User interface (software)SEMI-compliant GUI
Maximum write area228 x 228 mm² (others on request)
Substrate size4", 5", 6", 7", and 9" masks (larger and other substrates on request)
System features
Optics0.9 NA objective lens
Low-distortion UV optics
Automatic calibration routines
LaserHigh power diode pumped solid state laser with 355nm wavelength
Focus systemReal-time optical autofocus
AlignmentCamera system
Distortion compensation
Global and Field-by-field alignment
Edge detector
Data pathReal-time compression
Scalable hardware concept
Input formats: All standard formats, e.g. GDSII and Jobdeck
Spatial Light ModulatorFrequency 350 kHz
Data rate 2.4 GB/s
AutomationFull automatic mask handling with two carrier stations up to 9“; optional SECS/GEM protocols
System dimensionsSystem / Electronic rack
Width [mm]2995 / 800
Depth [mm]1652 / 650
Height [mm]2102 / 1800
Weight [kg]3400 / 180
Installation requirements
Electrical400 VAC ± 5%, 50/60 Hz, 16A, 3 phases
Compressed air7 - 10 bar (without oil or other residue)

Please note
Specifications depend on individual process conditions and may vary according to equipment configuration. Write speed depends on pixel size and write mode. Design and specifications are subject to change without prior notice.

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