ULTRA

Designed to produce mature semiconductor photomasks

Product Description
The ULTRA is a qualified laser mask writer specifically for mature semiconductor photomasks. Semiconductor photomasks are used to fabricate electronic devices including microcontrollers, power management, LED, Internet of Things (IoT) and MEMS.

The ULTRA is an economical mask writer solution with all the features and functionality required for high throughput, precision and structure uniformity, and extremely accurate alignment. The standard configuration includes features like full automatic mask handling, Zerodur® stage, low distortion optics and high-precision position control.
ULTRA systems can produce structure sizes down to 500 nm at write speeds up 580 mm² per minute, while featuring excellent critical dimension uniformity, image quality, overlay and registration. As a compact system, it fits easily into the existing mask shop infrastructure.
Product Highlights
High Exposure Quality

Custom High NA write lens and low distortion UV-optics

High Precision

Full air-bearing stage; zero thermal expansion ZERODUR® chuck; high resolution differential interferometer; stage corrections and tool matching functions

High Throughput

Fast SLM based exposure engine; fast mode; 6“ write time below 45 minutes
Available Modules

The ULTRA is a qualified laser mask writer specifically for mature semiconductor photomasks. Semiconductor photomasks are used to fabricate electronic devices including microcontrollers, power management, LED, Internet of Things (IoT) and MEMS.

The ULTRA is an economical mask writer solution with all the features and functionality required for high throughput, precision and structure uniformity, and extremely accurate alignment. The standard configuration includes features like full automatic mask handling, Zerodur® stage, low distortion optics and high-precision position control.
ULTRA systems can produce structure sizes down to 500 nm at write speeds up 580 mm² per minute, while featuring excellent critical dimension uniformity, image quality, overlay and registration. As a compact system, it fits easily into the existing mask shop infrastructure.

High Exposure Quality

Custom High NA write lens and low distortion UV-optics

High Precision

Full air-bearing stage; zero thermal expansion ZERODUR® chuck; high resolution differential interferometer; stage corrections and tool matching functions

High Throughput

Fast SLM based exposure engine; fast mode; 6“ write time below 45 minutes

Customer applications

The ULTRA’s data path has been designed to be able to handle even complex geometries and dense patterns while upholding high exposure speed – even round or circular features can be written easily. The image shows circles (Ø 5 µm) etched in chrome with a line width of 600 nm.

This optical microscope image shows a structure etched in chrome with a line width of 700 nm.

Regular structure showing unifomity etched in chrome (line width 1 μm).
Optical microscope image with a top illumination. — Regular structure showing unifomity etched in chrome (line width 1 μm). Optical microscope image with a top illumination.

The image shows 500 nm tilted lines and spaces; a key element of major relevance to many applications like processors, printed circuits, and structures in photonics, for example optical grids.

500 nm holes with high density in IP3250 resist on Si Wafer. Uniformity of the exposure.

SEM image of a waveguide pattern exposed in a 550 nm thick positive resist showing nice smooth edges and sharp vertical walls.
(Courtesy of IMS Chips) — SEM image of a waveguide pattern exposed in a 550 nm thick positive resist showing nice smooth edges and sharp vertical walls. (Courtesy of IMS Chips)

	QX mode	FX mode
Writing performance
Address grid [nm]	4	10
Line edge roughness [3σ, nm]	20	40
Position accuracy [3σ, nm]	40	100
Overlay [3σ, nm]	30	60
Stitching [3σ, nm]	20	60
2nd layer alignment [max error / nm]	100	100
CD uniformity [3σ, nm]	30	60
Minimum feature size [nm]	500	700
Write speed [mm² / min]	325	580
Write time for 6″ x 6″ [min]	75	45

Operation
User interface (software)	SEMI-compliant GUI
Maximum write area	228 x 228 mm² (others on request)
Substrate size	4", 5", 6", 7", and 9" masks (larger and other substrates on request)

System features
Optics	0.9 NA objective lens Low-distortion UV optics Automatic calibration routines
Laser	High power diode pumped solid state laser with 355nm wavelength
Focus system	Real-time optical autofocus
Alignment	Camera system Distortion compensation Global and Field-by-field alignment Edge detector
Data path	Real-time compression Scalable hardware concept Input formats: All standard formats, e.g. GDSII and Jobdeck
Spatial Light Modulator	Frequency 350 kHz Data rate 2.4 GB/s
Automation	Full automatic mask handling with two carrier stations up to 9“; optional SECS/GEM protocols

System dimensions	System / Electronic rack
Width [mm]	2995 / 800
Depth [mm]	1652 / 650
Height [mm]	2102 / 1800
Weight [kg]	3400 / 180

Installation requirements
Electrical	400 VAC ± 5%, 50/60 Hz, 16A, 3 phases
Compressed air	7 - 10 bar (without oil or other residue)

Please note
Specifications depend on individual process conditions and may vary according to equipment configuration. Write speed depends on pixel size and write mode. Design and specifications are subject to change without prior notice.

Download BROCHURE

ULTRA

Designed to produce mature semiconductor photomasks

High Exposure Quality

High Precision

High Throughput

High Exposure Quality

High Precision

High Throughput

Customer applications

Technical Data

Get in Touch

Sign up

Stay connected

APPLICATIONS

CORE TECHNOLOGIES

KEY FEATURES

PRODUCTS

SERVICE

COMPANY