MEMS

Flexible Small Batch Production

Description
MEMS, short for Micro-Electro-Mechanical Systems, are microsystem components that range in size from 1 µm to 100 µm. These tiny devices enable the miniaturization of existing devices, provide new functionality using physical principles not available at the macroscale, and facilitate the development of tools that operate in the microworld. MEMS can appear as complex machines such as sensors and actuators or as simple structures like cantilevers, gearwheels, or other mechanical parts.

MEMS are used in a wide variety of applications, including accelerometers, gyroscopes, pressure sensors, biosensors, micropumps, microvalves, and many more. MOEMS, or Micro-Optical-Electro-Mechanical Systems, are a deviation from standard MEMS that combines micro-optics with other MEMS components. Examples of MOEMS include optical switches, optical modulators, and optical interconnects.

MEMS fabrication relies on the utilization of semiconductor process technology, which includes layer deposition, photolithographic patterning, and etching techniques to achieve the desired device shape.

Direct Write Lithography is a highly flexible technique for modifying and shaping materials at the nano- and micro-scale. Heidelberg Instruments’ DWL and MLA series of Direct Write Laser Lithography tools can be used to create etch masks on silicon, high aspect ratio structures in thick photoresists, and material deposition in cleared resist patterns. Visit the corresponding product pages to find out more (see below).
Requirements
Rapid prototyping

Various structure shapes and dimensions

Throughput independent of pattern complexity
Solutions
High throughput

Exposure speeds up to 5000 mm²/min

Grayscale lithography (DWL series)

Used to pattern both simple or complex 2.5D topographies (e.g., tapered channels)

High aspect ratio

Tall structures up to 1mm in height

No undercut

The structures can be used for replication

MEMS, short for Micro-Electro-Mechanical Systems, are microsystem components that range in size from 1 µm to 100 µm. These tiny devices enable the miniaturization of existing devices, provide new functionality using physical principles not available at the macroscale, and facilitate the development of tools that operate in the microworld. MEMS can appear as complex machines such as sensors and actuators or as simple structures like cantilevers, gearwheels, or other mechanical parts.

MEMS are used in a wide variety of applications, including accelerometers, gyroscopes, pressure sensors, biosensors, micropumps, microvalves, and many more. MOEMS, or Micro-Optical-Electro-Mechanical Systems, are a deviation from standard MEMS that combines micro-optics with other MEMS components. Examples of MOEMS include optical switches, optical modulators, and optical interconnects.

MEMS fabrication relies on the utilization of semiconductor process technology, which includes layer deposition, photolithographic patterning, and etching techniques to achieve the desired device shape.

Direct Write Lithography is a highly flexible technique for modifying and shaping materials at the nano- and micro-scale. Heidelberg Instruments’ DWL and MLA series of Direct Write Laser Lithography tools can be used to create etch masks on silicon, high aspect ratio structures in thick photoresists, and material deposition in cleared resist patterns. Visit the corresponding product pages to find out more (see below).