DWL 2000/4000 GS

The industrial-level grayscale lithography tool

DWL 2000 / 4000 GS laser lithography systems are fast and flexible high-resolution pattern generators. They are optimized for industrial-level grayscale lithography and designed for high-throughput patterning of masks and wafers for integrated circuits, MEMS, micro-optic and microfluidic devices, sensors, holograms and security features on banknotes and ID cards.

The Professional Grayscale Lithography Mode enables patterning of complex 2.5D structures in thick photoresist over large areas. With a minimum feature size of 500 nm, a write area of up to 400 mm x 400 mm and optional automatic loading system, DWL 2000 / 4000 GS systems are particularly suitable for wafer-level micro-optics used for telecommunications, illumination and industrial display manufacturing, as well as for device fabrication in life sciences.

Exposure Quality

CD uniformity 60 nm; edge roughness 40 nm; alignment accuracy 60 nm; 2nd layer alignment 250 nm; autofocus compensation 80 µm

Grayscale Lithography

1000 gray levels; dedicated GenISys BEAMER software for optimizing the exposure of complex geometries

Temperature-controlled Flow Box

Temperature stability ± 0.1°, ISO 4 environment

Exposure Speed

area of 200 mm x 200 mm in grayscale mode in <60 minutes

Large Substrate Size

Up to 20 / 40 cm

5 Write Modes

Min. features from 500 nm to 2 μm

Exposure Wavelength

Diode laser at 405 nm

Autofocus

Air-gauge or optical

Automation

Loading unit; additional substrate carrier station; pre-aligner and substrate scanner

GenISys BEAMER

Conversion software packages with 3D proximity correction (3D-PEC) for grayscale exposures of complex shapes

Customer applications

2.5D features created by Grayscale Lithography are in many cases used for microoptics. A surface may for example be structured in a targeted way to lead to controlled reflection or diffusion of light. The image shows such a type of periodic surface patterning featuring sharp peaks and tips.
(Courtesy of IGI) — 2.5D features created by Grayscale Lithography are in many cases used for microoptics. A surface may for example be structured in a targeted way to lead to controlled reflection or diffusion of light. The image shows such a type of periodic surface patterning featuring sharp peaks and tips. (Courtesy of IGI)

MR-DWL is a special negative resist that enables high-aspect ratio structures with an aspect ratio of up to 1:40. This epoxy-based photoresist from micro resist technology GmbH is specifically optimized for direct-write lithography and DWL systems. It is sensitive above 400 nm and can be applied in a thickness up to several hundreds of microns.
(Courtesy of V. Cadarso and J. Brugger, EPFL) — MR-DWL is a special negative resist that enables high-aspect ratio structures with an aspect ratio of up to 1:40. This epoxy-based photoresist from micro resist technology GmbH is specifically optimized for direct-write lithography and DWL systems. It is sensitive above 400 nm and can be applied in a thickness up to several hundreds of microns. (Courtesy of V. Cadarso and J. Brugger, EPFL)

A test pattern exposed with a DWL 2000 shows accurate alignment of elements exposed in two subsequent layers (arrows, crosses, arrow tips). Alignment is a crucial parameter for multilayer lithography applications, such as sensors and semiconductor devices.
(Courtesy of Heidelberg Instruments) — A test pattern exposed with a DWL 2000 shows accurate alignment of elements exposed in two subsequent layers (arrows, crosses, arrow tips). Alignment is a crucial parameter for multilayer lithography applications, such as sensors and semiconductor devices. (Courtesy of Heidelberg Instruments)

A diffuser comprising pyramids with 15 µm height and 20µm base length in AZ4620 resist. Such structured surfaces created by Grayscale Lithography are key elements for microoptics applications.
(Courtesy of Heidelberg Instruments) — A diffuser comprising pyramids with 15 µm height and 20µm base length in AZ4620 resist. Such structured surfaces created by Grayscale Lithography are key elements for microoptics applications. (Courtesy of Heidelberg Instruments)

A 2.5D fan-shaped structure, created in AZ4620 with a minimum feature size of less than 5 μm.
(Courtesy of Kuraray) — A 2.5D fan-shaped structure, created in AZ4620 with a minimum feature size of less than 5 μm. (Courtesy of Kuraray)

A grating fabricated using DWL 2000 in 500 nm of Shipley S1805. The groove density is 600 lines/mm with the resulting optical gratings having a wave-front error of ± 25 nm. In effective optical gratings, the wave front error must be smaller than λ / 10. Such structures are used in spectrometers, monochromators, lasers, and other devices.
(Courtesy of Heidelberg Instruments and Berkeley Laboratories) — A grating fabricated using DWL 2000 in 500 nm of Shipley S1805. The groove density is 600 lines/mm with the resulting optical gratings having a wave-front error of ± 25 nm. In effective optical gratings, the wave front error must be smaller than λ / 10. Such structures are used in spectrometers, monochromators, lasers, and other devices. (Courtesy of Heidelberg Instruments and Berkeley Laboratories)

Write mode	I	II	III	IV	V
Writing performance
Minimum Feature Size [µm]	0.5	0.7	0.8	1	2
Minimum Lines and Spaces [µm]	0.7	0.9	1	1.5	3
Address Grid [nm]	5	10	12.5	25	50
Edge Roughness [3σ, nm]	40	50	60	80	110
CD Uniformity [3σ, nm]	60	70	80	130	180
2nd layer alignment over 100 x 100 mm² [3σ, nm]	250	250	250	250	250
Registration [3σ, nm]	200	200	200	200	200
Write Speed [mm²/minute]	12	50	75	270	870

System features
Light source	Diode laser with 405 nm
Maximum substrate size	DWL GS 2000: 9″ x 9″ / DWL 4000: 17″ x 17″
Substrate thickness	0 to 12 mm
Maximum exposure area	DWL 2000 GS: 200 x 200 mm² / DWL 4000 GS: 400 x 400 mm²
Temperature controlled flow box	Temperature stability ± 0.1°, ISO 4 environment
Real-time autofocus	Optical autofocus or air-gauge autofocus
Autofocus compensation range	80 μm

Further options
Professional Grayscale Mode	1000 gray levels, professional data conversion software
Automatic loading system	Automatic loading unit, optional additional substrate carrier station, optional pre-aligner and wafer scanner

System dimensions (DWL 2000 GS)
DWL 2000 GS lithography unit (width × depth × height); weight	2020 mm × 1250 mm × 2100 mm; 2500 kg
Electronic rack (width × depth × height); weight	800 mm × 650 mm × 1800 mm; 180 kg

Installation requirements
Electrical	400 VAC ± 5 %, 50/60 Hz, 32 A
Compressed air	6 - 10 bar
Cleanroom	ISO 6 or better recommended

Please note
Specifications depend on individual process conditions and may vary according to equipment configuration. Write speed depends on pixel size and write mode. Design and specifications are subject to change without prior notice

Download BROCHURE

DWL 2000/4000 GS

The industrial-level grayscale lithography tool

Exposure Quality

Grayscale Lithography

Temperature-controlled Flow Box

Exposure Speed

Large Substrate Size

5 Write Modes

Exposure Wavelength

Autofocus

Automation

GenISys BEAMER

Customer applications

Technical Data

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