The industrial-level grayscale lithography tool
DWL 2000 / 4000 GS laser lithography systems are fast and flexible high-resolution pattern generators. They are optimized for industrial-level grayscale lithography and designed for high-throughput patterning of masks and wafers for integrated circuits, MEMS, micro-optic and microfluidic devices, sensors, holograms and security features on banknotes and ID cards.
The Professional Grayscale Lithography Mode enables patterning of complex 2.5D structures in thick photoresist over large areas. With a minimum feature size of 500 nm, a write area of up to 400 mm x 400 mm and optional automatic loading system, DWL 2000 / 4000 GS systems are particularly suitable for wafer-level micro-optics used for telecommunications, illumination and industrial display manufacturing, as well as for device fabrication in life sciences.
Exposure Quality
Grayscale Lithography
Temperature-controlled Flow Box
Exposure Speed
Large Substrate Size
5 Write Modes
Exposure Wavelength
Autofocus
Automation
GenISys BEAMER
Customer applications
Technical Data
Write mode | I | II | III | IV | V |
---|---|---|---|---|---|
Writing performance | |||||
Minimum Feature Size [µm] | 0.5 | 0.7 | 0.8 | 1 | 2 |
Minimum Lines and Spaces [µm] | 0.7 | 0.9 | 1 | 1.5 | 3 |
Address Grid [nm] | 5 | 10 | 12.5 | 25 | 50 |
Edge Roughness [3σ, nm] | 40 | 50 | 60 | 80 | 110 |
CD Uniformity [3σ, nm] | 60 | 70 | 80 | 130 | 180 |
2nd layer alignment over 100 x 100 mm² [3σ, nm] | 250 | 250 | 250 | 250 | 250 |
Registration [3σ, nm] | 200 | 200 | 200 | 200 | 200 |
Write Speed [mm²/minute] | 12 | 50 | 75 | 270 | 870 |
System features | |
---|---|
Light source | Diode laser with 405 nm |
Maximum substrate size | DWL GS 2000: 9″ x 9″ / DWL 4000: 17″ x 17″ |
Substrate thickness | 0 to 12 mm |
Maximum exposure area | DWL 2000 GS: 200 x 200 mm² / DWL 4000 GS: 400 x 400 mm² |
Temperature controlled flow box | Temperature stability ± 0.1°, ISO 4 environment |
Real-time autofocus | Optical autofocus or air-gauge autofocus |
Autofocus compensation range | 80 μm |
Further options | |
Professional Grayscale Mode | 1000 gray levels, professional data conversion software |
Automatic loading system | Automatic loading unit, optional additional substrate carrier station, optional pre-aligner and wafer scanner |
System dimensions (DWL 2000 GS) | |
DWL 2000 GS lithography unit (width × depth × height); weight | 2020 mm × 1250 mm × 2100 mm; 2500 kg |
Electronic rack (width × depth × height); weight | 800 mm × 650 mm × 1800 mm; 180 kg |
Installation requirements | |
Electrical | 400 VAC ± 5 %, 50/60 Hz, 32 A |
Compressed air | 6 - 10 bar |
Cleanroom | ISO 6 or better recommended |
Please note
Specifications depend on individual process conditions and may vary according to equipment configuration. Write speed depends on pixel size and write mode. Design and specifications are subject to change without prior notice