VPG 300 DI

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The maskless direct imager VPG 300 DI for
high accuracy and high resolution microstructures

  • Product Description

  • The VPG 300 DI is a Volume Pattern Generator specially designed for direct writing high-resolution microstructures in i-line resists. Derived from the mask making tool, it features all advanced VPG+ system components to be able to write with the highest precision and accuracy. The maximum write area covers a 300 mm wafer.
    The target usage of the VPG 300 DI system is primarily in academic and industrial research and development, where high flexibility and features smaller than 2 µm are required. This system caters to the needs of various applications, including product prototyping, MEMS, mix and match with other tools, and writing of structures with quasi-stitching-less unlimited die sizes. The VPG 300 DI performance is comparable to a mask-based i-line stepper that is traditionally used for these applications, while providing the advantages of a maskless patterning technology.
    Similar to the VPG+, the VPG 300 DI is based on the same field-proven ultra-high-speed exposure optical engine. However, it goes a step further by incorporating additional advanced system components such as a Zerodur® stage, differential interferometer, and various options for metrology, alignment, and wafer handling.

    This combination of performance, technological benefits, and components makes the VPG 300 DI an ideal choice for researchers and developers seeking precise and efficient microstructure fabrication capabilities.

    The VPG 300 DI is a Volume Pattern Generator specially designed for direct writing high-resolution microstructures in i-line resists. Derived from the mask making tool, it features all advanced VPG+ system components to be able to write with the highest precision and accuracy. The maximum write area covers a 300 mm wafer.
    The target usage of the VPG 300 DI system is primarily in academic and industrial research and development, where high flexibility and features smaller than 2 µm are required. This system caters to the needs of various applications, including product prototyping, MEMS, mix and match with other tools, and writing of structures with quasi-stitching-less unlimited die sizes. The VPG 300 DI performance is comparable to a mask-based i-line stepper that is traditionally used for these applications, while providing the advantages of a maskless patterning technology.
    Similar to the VPG+, the VPG 300 DI is based on the same field-proven ultra-high-speed exposure optical engine. However, it goes a step further by incorporating additional advanced system components such as a Zerodur® stage, differential interferometer, and various options for metrology, alignment, and wafer handling.

    This combination of performance, technological benefits, and components makes the VPG 300 DI an ideal choice for researchers and developers seeking precise and efficient microstructure fabrication capabilities.

  • Product Highlights

  • Exposure Speed

    Custom made high-speed spatial light modulator; optimized optical engine performance and data path. Can write a 100 x 100 mm2 area in 9 minutes

    Exposure Quality

    Edge roughness < 40 nm, CD uniformity < 60 nm, resolution down to 500 nm

    Alignment Accuracy

    2nd layer alignment (topside) down to 100 nm, backside VIS / IR ±1 µm

    Automated Alignment

    Automated global and local alignment with distortion corrections; VIS backside alignment; IR alignment for buried structures

    Autofocus

    Optical or pneumatic autofocus with dynamic compensation up to 80 µm

    Included metrology functions

    Position, CD and edge roughness

    Writing Stability

    Integrated ambient metrology, flowbox, and software corrections to compensate environmental changes

  • Available Modules

  • Automatic handling options

    Open frame handling with SEMI standard carriers and prealigning available for 100 to 200 mm or 200 / 300 mm standard wafers (others on request)

    Two write modes to choose from

    High NA for highest resolution or lower NA optimized for throughput or DOF critical applications

    Alignment options

    VIS and IR backside alignment

    Service Contracts

    Worldwide service level agreements for faster on-site support and access to spare parts

The VPG 300 DI is a Volume Pattern Generator specially designed for direct writing high-resolution microstructures in i-line resists. Derived from the mask making tool, it features all advanced VPG+ system components to be able to write with the highest precision and accuracy. The maximum write area covers a 300 mm wafer.
The target usage of the VPG 300 DI system is primarily in academic and industrial research and development, where high flexibility and features smaller than 2 µm are required. This system caters to the needs of various applications, including product prototyping, MEMS, mix and match with other tools, and writing of structures with quasi-stitching-less unlimited die sizes. The VPG 300 DI performance is comparable to a mask-based i-line stepper that is traditionally used for these applications, while providing the advantages of a maskless patterning technology.
Similar to the VPG+, the VPG 300 DI is based on the same field-proven ultra-high-speed exposure optical engine. However, it goes a step further by incorporating additional advanced system components such as a Zerodur® stage, differential interferometer, and various options for metrology, alignment, and wafer handling.

This combination of performance, technological benefits, and components makes the VPG 300 DI an ideal choice for researchers and developers seeking precise and efficient microstructure fabrication capabilities.

The VPG 300 DI is a Volume Pattern Generator specially designed for direct writing high-resolution microstructures in i-line resists. Derived from the mask making tool, it features all advanced VPG+ system components to be able to write with the highest precision and accuracy. The maximum write area covers a 300 mm wafer.
The target usage of the VPG 300 DI system is primarily in academic and industrial research and development, where high flexibility and features smaller than 2 µm are required. This system caters to the needs of various applications, including product prototyping, MEMS, mix and match with other tools, and writing of structures with quasi-stitching-less unlimited die sizes. The VPG 300 DI performance is comparable to a mask-based i-line stepper that is traditionally used for these applications, while providing the advantages of a maskless patterning technology.
Similar to the VPG+, the VPG 300 DI is based on the same field-proven ultra-high-speed exposure optical engine. However, it goes a step further by incorporating additional advanced system components such as a Zerodur® stage, differential interferometer, and various options for metrology, alignment, and wafer handling.

This combination of performance, technological benefits, and components makes the VPG 300 DI an ideal choice for researchers and developers seeking precise and efficient microstructure fabrication capabilities.

Exposure Speed

Custom made high-speed spatial light modulator; optimized optical engine performance and data path. Can write a 100 x 100 mm2 area in 9 minutes

Exposure Quality

Edge roughness < 40 nm, CD uniformity < 60 nm, resolution down to 500 nm

Alignment Accuracy

2nd layer alignment (topside) down to 100 nm, backside VIS / IR ±1 µm

Automated Alignment

Automated global and local alignment with distortion corrections; VIS backside alignment; IR alignment for buried structures

Autofocus

Optical or pneumatic autofocus with dynamic compensation up to 80 µm

Included metrology functions

Position, CD and edge roughness

Writing Stability

Integrated ambient metrology, flowbox, and software corrections to compensate environmental changes

Automatic handling options

Open frame handling with SEMI standard carriers and prealigning available for 100 to 200 mm or 200 / 300 mm standard wafers (others on request)

Two write modes to choose from

High NA for highest resolution or lower NA optimized for throughput or DOF critical applications

Alignment options

VIS and IR backside alignment

Service Contracts

Worldwide service level agreements for faster on-site support and access to spare parts

Customer applications

VPG 300 DI High NA mode: Grid of round 500 nm features with a high density in IP resist. Demonstration of resolution abilities.
VPG 300 DI High NA mode: Grid of round 500 nm features with a high density in IP resist. Demonstration of resolution abilities.
Photonic splitter pattern in positive resist. Reduced writing grid was applied for smooth interpolated roundings and sharp edges.
Photonic splitter pattern in positive resist. Reduced writing grid was applied for smooth interpolated roundings and sharp edges.
8-level quartz Diffractive Optical Element (DOE). The pixels are about 2 μm in size, the array of devices covers an area of about 20 mm. (Courtesy of IMS Chips)
8-level quartz Diffractive Optical Element (DOE). The pixels are about 2 μm in size, the array of devices covers an area of about 20 mm. (Courtesy of IMS Chips)
Fine line test structure down to 0.8 µm (Epoxy Mold Compound). (Courtesy of Fraunhofer IZM - Panel Level Consortium 2.0)
Fine line test structure down to 0.8 µm (Epoxy Mold Compound). (Courtesy of Fraunhofer IZM - Panel Level Consortium 2.0)
Fine pitch Cu pillars chiplet connection. (Courtesy of Fraunhofer IZM)
Fine pitch Cu pillars chiplet connection. (Courtesy of Fraunhofer IZM)
Personalized contacts layer and metalized lines on a prefabricated CMOS master. (Courtesy of IMS Chips)
Personalized contacts layer and metalized lines on a prefabricated CMOS master. (Courtesy of IMS Chips)

Why customers choose our systems

The VPG allows us to realize copper lines and chip-to-chip interconnects with a size down to 1 µm, which is three times smaller in feature size than when using the conventional mask aligner process.

Markus Wöhrmann
Group leader Lithography and Thin Film Polymers for Wafer Level Packaging
Fraunhofer Institute for Microintegration and Reliability
Berlin, Germany

Technical Data

Write modeIII
Writing performance
Minimum feature size [µm]0.50.8
Minimum lines and spaces [µm]0.81.2
Address Grid [nm]48
Edge roughness [3σ, nm]3040
CD uniformity [3σ, nm]5060
2nd layer alignment (global) [nm]100130
Write speed [mm2/min]340*1020*
*Fast mode: 680 and 2056 mm2/min with similar performance, but without specification
Exposure time for 100 x 100 mm2 area [min]3917
System features
Light sourceHigh-power DPSS laser with 355 nm
Maximum substrate size and write area300 x 300 mm2
Substrate thickness0 to 12 mm (other thicknesses on request)
Maximum exposure area300 x 300 mm2
AutofocusRealtime autofocus system (optical and pneumatic)
Autofocus compensation rangeUp to 80 µm
Flowbox(Closed-loop) temperature controlled environmental chamber
Alignment and metrologyCamera system and software package for metrology and alignment
Other features and optionsFull automatic handling and prealigning of 100, 150, 200, and 300 mm wafers. Optical edge detection, topside alignment and optional IR and backside alignment. Zerodur® stage and high-resolution differential interferometer
System dimensions
System / Electronic rack
Width [mm]2605 / 800
Depth [mm]1652 / 650
Height [mm]2102 / 1800
Weight [kg]3550 / 180
Installation requirements
Electrical400 VAC ± 5 %, 50/60 Hz, 16 A, 3 phases
Compressed air6 - 10 bar

Please note
Specifications depend on individual process conditions and may vary according to equipment configuration. Write speed depends on pixel size and write mode. Design and specifications are subject to change without prior notice.

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