MLA 150

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The fastest maskless aligner for R&D, rapid prototyping, and small production volumes

  • Product Description

  • The Maskless Aligner MLA 150 is a state-of-the-art Maskless Lithography tool. Areas of application include nanofabrication of quantum devices (2D materials, semiconductor materials, nanowires, etc.), MEMS, micro-optical elements, sensors, actuators, MOEMS and other devices for materials and life sciences. Depending on the application, the MLA 150 patterns high-resolution, high aspect ratio, and even simple grayscale structures.

    Our Maskless Aligner series, first introduced in 2015, is now firmly established as an alternative to the traditional mask aligner, fully eliminating the need for masks. The maskless approach leads to significantly reduced cycle times. Any design modifications can be quickly implemented by simply changing the CAD layout. The system also features fast automated front- and backside alignment procedures and outstanding speed: Exposing an area of 100 x 100 mm² with structures as small as 1 µm takes less than 10 minutes.

    The 150th MLA 150 installed in 2022: The MLA 150 Success Story

    The Maskless Aligner MLA 150 is a state-of-the-art Maskless Lithography tool. Areas of application include nanofabrication of quantum devices (2D materials, semiconductor materials, nanowires, etc.), MEMS, micro-optical elements, sensors, actuators, MOEMS and other devices for materials and life sciences. Depending on the application, the MLA 150 patterns high-resolution, high aspect ratio, and even simple grayscale structures.

    Our Maskless Aligner series, first introduced in 2015, is now firmly established as an alternative to the traditional mask aligner, fully eliminating the need for masks. The maskless approach leads to significantly reduced cycle times. Any design modifications can be quickly implemented by simply changing the CAD layout. The system also features fast automated front- and backside alignment procedures and outstanding speed: Exposing an area of 100 x 100 mm² with structures as small as 1 µm takes less than 10 minutes.

    The 150th MLA 150 installed in 2022: The MLA 150 Success Story

    > 250 installed systems

  • Product Highlights

  • Perfect for Multi-User Facilities

    Less than 1h training to fully qualify as a user

    Fast and Accurate Alignment

    250 nm front alignment, backside alignment, alignment error compensation

    Flexible

    Two lasers can be installed simultaneously on the same system to expose the whole range of photoresist
    Different exposure modes available for fast or high-quality structuring
    Additional vacuum chucks for challenging samples like small substrates, foils, or warped substrates

    Low Operation Costs and Easy Maintenance

    10-20 years of laser lifetime

    Direct-Write Lithography

    No mask-related costs, effort, or security risks

    Grayscale Mode

    For simple 2.5D structures

    Exposure Quality

    Edge roughness 60 nm; CD uniformity 100 nm; autofocus compensation for warped/corrugated substrates

    Minimum Feature Size

    Two different write modes available with a minimum feature size down to 0.45 μm

    User-Friendly

    Specifically designed software and workflow make the tool operation fast and easy

    Exposure Speed

    150 mm wafer in <16 min with 405 nm laser

  • Available Modules

  • Exposure Wavelength

    Diode laser sources at 375 nm and/or 405 nm can be mounted together and used interchangeably to expose different photoresists

    Exchangeable Chucks

    Additional vacuum chucks for challenging samples like small substrates, foils, or warped substrates
    Customized vacuum chuck layout upon request

    Draw Mode

    Import and overlay of BMP files on top of the real-time microscope image – as in a virtual mask aligner; simple lines and shapes can be drawn into the real-time camera image for immediate exposure

    Autofocus

    Air-gauge or optical autofocus for perfect exposure of small samples (less than 10 mm)

    Variable Substrate Sizes

    From 3 mm to 6”; up to 8” upon request

    Advanced Field Alignment

    Automatic field-by-field alignment on individual dies on the wafer for superior alignment accuracy

The Maskless Aligner MLA 150 is a state-of-the-art Maskless Lithography tool. Areas of application include nanofabrication of quantum devices (2D materials, semiconductor materials, nanowires, etc.), MEMS, micro-optical elements, sensors, actuators, MOEMS and other devices for materials and life sciences. Depending on the application, the MLA 150 patterns high-resolution, high aspect ratio, and even simple grayscale structures.

Our Maskless Aligner series, first introduced in 2015, is now firmly established as an alternative to the traditional mask aligner, fully eliminating the need for masks. The maskless approach leads to significantly reduced cycle times. Any design modifications can be quickly implemented by simply changing the CAD layout. The system also features fast automated front- and backside alignment procedures and outstanding speed: Exposing an area of 100 x 100 mm² with structures as small as 1 µm takes less than 10 minutes.

The 150th MLA 150 installed in 2022: The MLA 150 Success Story

The Maskless Aligner MLA 150 is a state-of-the-art Maskless Lithography tool. Areas of application include nanofabrication of quantum devices (2D materials, semiconductor materials, nanowires, etc.), MEMS, micro-optical elements, sensors, actuators, MOEMS and other devices for materials and life sciences. Depending on the application, the MLA 150 patterns high-resolution, high aspect ratio, and even simple grayscale structures.

Our Maskless Aligner series, first introduced in 2015, is now firmly established as an alternative to the traditional mask aligner, fully eliminating the need for masks. The maskless approach leads to significantly reduced cycle times. Any design modifications can be quickly implemented by simply changing the CAD layout. The system also features fast automated front- and backside alignment procedures and outstanding speed: Exposing an area of 100 x 100 mm² with structures as small as 1 µm takes less than 10 minutes.

The 150th MLA 150 installed in 2022: The MLA 150 Success Story

> 250 installed systems

Perfect for Multi-User Facilities

Less than 1h training to fully qualify as a user

Fast and Accurate Alignment

250 nm front alignment, backside alignment, alignment error compensation

Flexible

Two lasers can be installed simultaneously on the same system to expose the whole range of photoresist
Different exposure modes available for fast or high-quality structuring
Additional vacuum chucks for challenging samples like small substrates, foils, or warped substrates

Low Operation Costs and Easy Maintenance

10-20 years of laser lifetime

Direct-Write Lithography

No mask-related costs, effort, or security risks

Grayscale Mode

For simple 2.5D structures

Exposure Quality

Edge roughness 60 nm; CD uniformity 100 nm; autofocus compensation for warped/corrugated substrates

Minimum Feature Size

Two different write modes available with a minimum feature size down to 0.45 μm

User-Friendly

Specifically designed software and workflow make the tool operation fast and easy

Exposure Speed

150 mm wafer in <16 min with 405 nm laser

Exposure Wavelength

Diode laser sources at 375 nm and/or 405 nm can be mounted together and used interchangeably to expose different photoresists

Exchangeable Chucks

Additional vacuum chucks for challenging samples like small substrates, foils, or warped substrates
Customized vacuum chuck layout upon request

Draw Mode

Import and overlay of BMP files on top of the real-time microscope image – as in a virtual mask aligner; simple lines and shapes can be drawn into the real-time camera image for immediate exposure

Autofocus

Air-gauge or optical autofocus for perfect exposure of small samples (less than 10 mm)

Variable Substrate Sizes

From 3 mm to 6”; up to 8” upon request

Advanced Field Alignment

Automatic field-by-field alignment on individual dies on the wafer for superior alignment accuracy

Customer applications

A wafer of superconducting detectors for the South Pole Telescope (SPT) camera. The camera carries an array of over 16000 such devices. Each of them comprises ultra-thin superconducting elements with features as small as 1 μm. Here, the MLA 150 was used to fabricate the Nb leads, which appear as bands in between the pixels.
A wafer of superconducting detectors for the South Pole Telescope (SPT) camera. The camera carries an array of over 16000 such devices. Each of them comprises ultra-thin superconducting elements with features as small as 1 μm. Here, the MLA 150 was used to fabricate the Nb leads, which appear as bands in between the pixels. (Courtesy of CNM at Argonne National Laboratory, photo by Clarence Chang)
A gear wheel patterned in 800 µm thick SU-8 demonstrates the capability of the MLA 150 to create vertical sidewalls in thick forks, gear wheels, piezoelectric material, bio-, chemical or pressure sensors, or other miniaturized physical devices.
A gear wheel patterned in 800 µm thick SU-8 demonstrates the capability of the MLA 150 to create vertical sidewalls in thick forks, gear wheels, piezoelectric material, bio-, chemical or pressure sensors, or other miniaturized physical devices.
A master for a microfluidic mixer to be transferred by soft lithography in PDMS. The structure is patterned in 100 μm SU-8 with the 375 nm laser wavelength of the MLA 150. This type of structure requires high-throughput for fast large-area patterning and precise stitching to ensure channel smoothness.
A master for a microfluidic mixer to be transferred by soft lithography in PDMS. The structure is patterned in 100 μm SU-8 with the 375 nm laser wavelength of the MLA 150. This type of structure requires high-throughput for fast large-area patterning and precise stitching to ensure channel smoothness. (Courtesy of CMi EPFL Center of MicroNanoTechnology)
Nanoholes as precisely positioned traps for nanoparticles fabricated using “mix-and-match” lithography. The 100 nm square “nanoholes” patterned with e-beam lithography are separated by the coarse trenches created using the MLA 150, which are precisely aligned to the existing nanohole pattern
Nanoholes as precisely positioned traps for nanoparticles fabricated using “mix-and-match” lithography. The 100 nm square “nanoholes” patterned with e-beam lithography are separated by the coarse trenches created using the MLA 150, which are precisely aligned to the existing nanohole pattern. (Courtesy of EPFL LMIS1, Lausanne)
An array of SQUIDs (superconducting quantum interference device) used for the readout of metallic magnetic microcalorimeters (high-resolution particle detectors operated at low temperatures). These devices are microfabricated in large arrays and comprise up to 18 layers with submicron features. The MLA 150 ensures the extreme overlay accuracy crucial for this application.
An array of SQUIDs (superconducting quantum interference device) used for the readout of metallic magnetic microcalorimeters (high-resolution particle detectors operated at low temperatures). These devices are microfabricated in large arrays and comprise up to 18 layers with submicron features. The MLA 150 ensures the extreme overlay accuracy crucial for this application. (Courtesy of the Kirchhoff Institute for Physics (KIP), Heidelberg University)
This specific patterning of “OSTEmers” retinal implants shows an example of novel medical implants. Bio-compatible, impermeable, and UV-curable OSTEmers are highly promising for artificial retina. Contactless exposure with the MLA 150 enables the patterning of this material, which is a viscous liquid during processing, and is virtually impossible to work with using other lithography tools.
This specific patterning of “OSTEmers” retinal implants shows an example of novel medical implants. Bio-compatible, impermeable, and UV-curable OSTEmers are highly promising for artificial retina. Contactless exposure with the MLA 150 enables the patterning of this material, which is a viscous liquid during processing, and is virtually impossible to work with using other lithography tools. (Courtesy of EPFL, Neuroengineering Laboratory)

Why customers choose our systems

"The MLA 150 is a very good compromise between flexibility, throughput, and performance. In our multiuser facilities, it is highly appreciated for fast prototyping on substrates of various dimensions and shapes. Because the acquisition of the MLA 150 has been a game changer in our lithography department we decided to get a second one."

Dr. Philippe Flückiger, Director of Operations
Ecole Polytechnique Fédérale de Lausanne (EPFL) Center of MicroNanoTechnology (CMi)
Lausanne, Switzerland

"At DTU Nanolab, part of the technical university of Denmark, we now have multiple maskless aligners from Heidelberg instruments. These tools fit our research-based operation perfectly, while also providing versatile tools for many of our industrial customers. One specific observation we made since we got our maskless aligners was a significant drop in the number of new masks ordered for our mask aligners, which dropped from about 1 mask per day to about 1 mask per month. Overall, we are very happy with our maskless aligners, both from the personnel side and the user side."

Jens H. Hemmigsen, Process Specialist
DTU Nanolab (Technical University of Denmark)
Lyngby, Denmark

"The MLA 150 direct laser writer, with its ease-of-use and versatility, is the ideal photolithography equipment. Since photomasks are no longer required to expose the wafer, the MLA 150 has helped to dramatically reduce the time & costs associated to the development and research on prototypes that require frequent changes in the layout."

Dr. Julien Dorsaz, Senior Photolithography Engineer
EPFL (CMi)
Lausanne, Switzerland

Technical Data

Write Mode I *Write Mode II *
Writing performance
Minimum feature size [μm]0.6 (0.45 optional)1
Minimum Lines and Spaces [μm]0.8 (0.45 optional)1.2
Global 2nd layer alignment [nm]500500
Local 2nd layer alignment [nm] 250250
Backside alignment [nm]10001000
Exposure time 405 nm laser for 4″ wafer [min]359
Exposure time 375 nm laser for 4″ wafer [min]3520
Max. write speed 405 nm laser [mm²/min] 2851100
Max. write speed 375 nm laser [mm²/min] 285500
System features
Light sourceDiode lasers: 8 W at 405 nm, 2.8 W at 375 nm, or both
Substrate sizesVariable: 3 x 3 mm² to 6″ x 6″ | Optional: 8″ x 8″ Customizable on request
Substrate thickness0 - 12 mm
Maximum exposure area150 x 150 mm² | Optional: 200 x 200 mm²
Temperature controlled flow boxTemperature stability ± 0.1 °C
Real-time autofocusAir-gauge or optical
Autofocus compensation range180 μm
Grayscale128 gray levels
Software featuresExposure wizard, resist database, automatic labeling and serialization, Draw Mode for CADless exposures, substrate tracking / history
System dimensions (lithography unit)
Height × width × depth1950 mm × 1300 mm × 1300 mm
Weight1100 kg
Installation requirements
Electrical230 VAC ± 5%, 50/60 Hz, 16 A
Compressed air6 - 10 bar
Economical considerations
Saves on the cost of photomasks
Low running costs for maintenance, energy consumption, spare parts
Solid state laser light sources with lifetime of several years
* Only one write mode can be installed on the system

Please note
Specifications depend on individual process conditions and may vary according to equipment configuration. Write speed depends on pixel size and write mode. Design and specifications are subject to change without prior notice.

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