The fastest maskless aligner for R&D, rapid prototyping and small production volumes, designed for binary lithography

The Maskless Aligner MLA 150 is a state-of-the-art maskless lithography tool. Areas of application include nanofabrication of quantum devices (2D materials, semiconductor materials, nanowires, etc.) MEMS, micro-optical elements, sensors, actuators, MOEMS and other devices for materials and life sciences. Depending on the application, the MLA 150 patterns high-resolution, high aspect ratio, and even simple grayscale structures.

Our Maskless Aligner series, first introduced in 2015, is now firmly established as an alternative to the traditional mask aligner, fully eliminating the need for masks. The maskless approach leads to significantly reduced cycle times. Any design modifications can be quickly implemented by simply changing the CAD layout. The system also features fast automated front- and backside alignment procedures and outstanding speed: Exposing an area of 100 x 100 mm² with structures as small as 1 µ takes less than 10 minutes.

The 150th MLA 150 installed in 2022: The MLA 150 Success Story

Perfect for Multi-user Facilities

Less than 1 h training to fully qualify as a user

Fast and Accurate Alignment

250 nm front alignment, backside alignment, alignment error compensation

Flexible

Two lasers can be installed simultaneously on the same system to expose the whole range of photoresist

Low Operation Costs and Easy Maintenance

10-20 years of laser lifetime

Direct-write Lithography

No mask-related costs, effort, or security risks

Grayscale Mode

For simple 2.5D structures

Exposure Quality

Edge roughness 60 nm; CD uniformity 100 nm; 40 nm address grid; autofocus compensation for warped/corrugated substrates

User-friendly

Specifically designed software and workflow make the tool operation fast and easy

Exposure Speed

150 mm wafer in <16 min with 405 nm laser

Exposure Wavelength

Diode laser sources at 375 nm and/or 405 nm can be mounted together and used interchangeably to expose different photoresists

Exchangeable Chucks

Custom vacuum layouts

Draw Mode

Import and overlay of BMP files on top of the real-time microscope image – as in a virtual mask aligner; simple lines and shapes can be drawn into the real-time camera image for immediate exposure

Autofocus

Air-gauge or optical autofocus for perfect exposure of small samples (less than 10 mm)

Variable Substrate Sizes

Between 3-6”; up to 8” upon request

Advanced Field Alignment

Automatic field-by-field alignment on individual dies on the wafer for superior alignment accuracy

Customer applications

Technical Data

Write Mode I *Write Mode II *
Writing performance
Minimum feature size [μm]0.61
Minimum Lines and Spaces [μm]0.81.2
Global 2nd layer alignment [nm]500500
Local 2nd layer alignment [nm] 250250
Backside alignment [nm]10001000
Exposure time 405 nm laser for 4″ wafer [min]359
Exposure time 375 nm laser for 4″ wafer [min]3520
Max. write speed 405 nm laser [mm²/min] 2851100
Max. write speed 375 nm laser [mm²/min] 285500
System features
Light sourceDiode lasers: 8 W at 405 nm, 2.8 W at 375 nm, or both
Substrate sizesVariable: 3 x 3 mm² to 6″ x 6″ | Optional: 8″ x 8″ Customizable on request
Substrate thickness0 - 12 mm
Maximum exposure area150 x 150 mm² | Optional: 200 x 200 mm²
Temperature controlled flow boxTemperature stability ± 0.1 °C
Real-time autofocusAir-gauge or optical
Autofocus compensation range180 μm
Grayscale128 gray levels
Software featuresExposure wizard, resist database, automatic labeling and serialization, Draw Mode for CADless exposures, substrate tracking / history
Optional Automatic Loading SystemCan handle masks up to 7" and wafers up to 8". A second cassette station, and a prealigner and wafer scanner are available as options.
System dimensions (lithography unit)
Height × width × depth1950 mm × 1300 mm × 1300 mm
Weight1100 kg
Installation requirements
Electrical230 VAC ± 5%, 50/60 Hz, 16 A
Compressed air6 - 10 bar
Economical considerations
Saves on the cost of photomasks
Low running costs for maintenance, energy consumption, spare parts
Solid state laser light sources with lifetime of several years
* Only one write mode can be installed on the system

Please note
Specifications depend on individual process conditions and may vary according to equipment configuration. Write speed depends on pixel size and write mode. Design and specifications are subject to change without prior notice.

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