Dates & Events

We are excited to announce that our technical experts will contribute to the conference program with two invited technical talks at the upcoming IEEE-ICEE 2025 in Bengaluru on December 14, 2025:

Session S11-E3 (HIAP) Packaging Equipment and Tooling: 
Talk “Maskless Lithography for Wafer Level Packaging Applications.”
Speaker: Steffen Diez, COO Heidelberg Instruments
Time: 14:50 h – 15:15 h

Session S13-G1 (SM): Lithography Processes and Modeling: 
Talk “Process Optimization and Comparative Analysis of Direct Laser Written Photomasks for Photonic Waveguide Patterning.”
Speaker: Matthias Wahl, Strategic Product Manager ULTRA and VPG series
Time: 16:00 h – 16:25 h

Join us to explore cutting-edge innovations in lithography and packaging technologies!

Meet and discuss your projects with the technical experts of Heidelberg Instruments at the shared booth of our local representative Labindia.

SEMICON Japan is the premier event that brings together the semiconductor manufacturing supply chain for the latest insights, trends and innovations as the industry powers digital transformation.

Visit Heidelberg Instruments at booth #E5412!

Established since 2007, this unique topical meeting features the latest breakthroughs in the field of Nanophotonics and Metamaterials.

The European Physical Society will organise the 10th International Topical Meeting on Nanophotonics and Metamaterials (NANOMETA-2026).

SPIE. Photonics West Exhibition is the world’s largest optics and photonics technologies event to discover the latest advances in lasers, biomedical optics, biophotonics, quantum, and optoelectronics shared by the optics and photonics community.  Heidelberg Instruments experts will be available for you to discuss your micro- and nanofabrication projects face to face. 

Join Heidelberg Instruments @Booth 4204!

NMLS brings together technical experts, researchers, and users from Nanoscribe, Heidelberg Instruments, GenISys and micro resist technology. The symposium serves as a vibrant meeting point for professionals in nano- and microfabrication to exchange ideas, discuss current developments, and explore future opportunities in the field.

nano tech is a place where innovative materials and next-generation devices are gathered to explore the implementation of future technologies in society based on nanotechnology, an important common base technology for research and development.

Join our experts at the Heidelberg Instruments booth to disover latest advances and solutions in maskless laser lithography and direct-write technologies ystems for your advanced nanofabrication.

The Swiss Surface and Interface Symposium

This exhibition will showcase the latest semiconductor materials, equipment, and related technologies.

From Materials to Metrology: Pushing the Limits of Lithography

Heidelberg Instruments is excited to participate in the SPIE Advanced Lithography + Patterning Conference 2026 showcasing our high-end lithography solutions.

Join the Heidelberg Instruments’ experts at Booth 622 to discuss your requirements and projects!

The 22nd International Conference & Exhibition on Device Packaging will be held in Phoenix, Arizona, on March 2-5, 2026. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields.

Heidelberg Instruments will be represented to discuss how our technology and systems can help address the packaging industry’s evolving needs.

Visit us @Booth #308!

The Zurich Nanofabrication Days (formerly the Thermal Probe Workshop) will celebrate their 10th edition on March 25–26, 2026, in Zürich, Switzerland.

This milestone marks an exciting evolution as the event expands its scope to welcome a broader nanofabrication community.

Registration will be opened soon!

SEMICON China connects you to the world’s fastest growing and most dynamic microelectronics market, and gives you the platform to showcase your products, technologies, and brand in front of the most qualified audience of industry professionals in China.

Heidelberg Instruments will be represented by Stella International Corporation Limited.

Visit us at booth #2381!

The International Conference on Electron, Ion and Photon Beam Technology and Nanofabrication (EIPBN), affectionately known as “3-Beams,” is the premier gathering of scientists and engineers. The 69th meeting of the EIPBN, where top researchers from academia, government laboratories, and industry from around the world meet will take place on May 26 – 29, 2026 at Colorado Convention Center.

Visit us at booth 6!

The 2026 IEEE 76th Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society.

Visit Heidelberg Instruments at booth 508!