Join us for an insightful webinar exploring the use of thermal scanning probe lithography (t-SPL) in advancing 2D material-based device engineering.
Dr. Aaron Lau, a leading researcher from IMRE Singapore, will discuss cutting-edge applications of t-SPL in addressing critical challenges in 2D materials and quantum device fabrication. These include innovative approaches to overcoming the limitations of material interfaces, contact quality, and device performance.
Dr. Lau’s talk will cover:
- Establishing high-quality contacts at cryogenic temperatures to reveal new insights into metal/2D semiconductor interfaces.
- The influence of dielectrics and interface roughness on carrier transport.
- Integrating ultrathin metal oxides printed from liquid metals with 2D materials.
- Leveraging thermal scanning probe techniques for interface and contact engineering in 2D material-based devices.
The presentation will feature real-world applications and demonstrate how a completely inert fabrication approach can address some of the most pressing challenges in engineering high-quality 2D material-based devices.