55th International Symposium on Microelectronics. The exhibition will be from Oct. 3 – Oct. 5.
Visit us at Booth # 417!
The 24th Semiconductor Exhibition(SEDEX 2022). Heidelberg Instruments Korea Ltd. will be present as an exhibitor.
The International Conference on Wafer Bonding – WaferBond’22. Heidelberg Instruments is Silver Sponsor of this event.
Heidelberg Instruments Inc. will be present as exhibitor.
The 41st Electronic Materials Symposium.
International Conference on Smart Sensors.
Heidelberg Instruments will be represented by Stella International Corporation Ltd.
µTAS is the 26th international conference on Miniaturized Systems for Chemistry and Life Sciences. Heidelberg Instruments will be represented by Stella International Corporation Limited. Virtual participation available.
Exhibition for PCB, Assembly, Thermal and Green Tech Industry. Heidelberg Instruments will be represented by Stella International Corporation Ltd.
Heidelberg Instruments will be represented by Irida Ibérica, S.L.
35th International Microprocesses and Nanotechnology Conference.
Hear the talk “Ultra-thick positive photoresist layers for maskless grayscale lithography.” by Dominique Collé, Technical Marketing and Application Manager at Heidelberg Instruments, Nov. 11, 1:50 pm.
Chips powering the data age. Exhibition for electronics manufacturing.
Visit us at Booth C1465!
International scientific gathering for materials research.
24th Electronics Packaging Technology Conference.
Heidelberg Instruments will be represented by Regional Business Network (RBN).
Australian Institute of Physics Congress.
Heidelberg Instruments will be represented by NanoVacuum Pty Ltd.
SEMICON Japan brings together the whole semiconductor manufacturing supply chain and the “SMART” applications powered by semiconductor technology, such as automotive and IoT.
