Dates & Events

The MRS Fall Meeting delivers a combination of interdisciplinary cutting-edge research, innovative technologies, and collaborative networking with the field’s leading minds, which leads to new discoveries in areas ranging from quantum materials to energy and sustainability.

Visit us at Booth 917!

Since its inauguration in 1997, the IEEE Electronics Packaging Technology Conference (EPTC) has been established as a highly reputable international electronics packaging conference and is the IEEE EPS flagship conference in the Asia and Pacific Region.

Visit us at Booth 12!

Join us for an insightful webinar exploring the use of thermal scanning probe lithography (t-SPL) in advancing 2D material-based device engineering.

Dr. Aaron Lau, a leading researcher from IMRE Singapore, will discuss cutting-edge applications of t-SPL in addressing critical challenges in 2D materials and quantum device fabrication. These include innovative approaches to overcoming the limitations of material interfaces, contact quality, and device performance.

Dr. Lau’s talk will cover:

• Establishing high-quality contacts at cryogenic temperatures to reveal new insights into metal/2D semiconductor interfaces.
• The influence of dielectrics and interface roughness on carrier transport.
• Integrating ultrathin metal oxides printed from liquid metals with 2D materials.
• Leveraging thermal scanning probe techniques for interface and contact engineering in 2D material-based devices.

The presentation will feature real-world applications and demonstrate how a completely inert fabrication approach can address some of the most pressing challenges in engineering high-quality 2D material-based devices.

SEMICON Japan is the premier event that brings together the semiconductor manufacturing supply chain for the latest insights, trends and innovations as the industry powers digital transformation. SEMICON Japan 2024 will highlight smart applications powered by semiconductor technology such as automotive and Internet of Things (IoT).

Visit Heidelberg Instruments at booth #5310!

The 38th International Conference on
Micro Electro Mechanical Systems (IEEE MEMS 2025)

Heidelberg Instruments will be represented by Stella International Corporation Limited.

SPIE Photonics West Exhibition 2025, the globally recognized event for providers of the best solutions, components, instruments, and system supports for the optics and photonics industry. Discover the latest advances in lasers, biomedical optics, biophotonics, quantum, and optoelectronics shared by the optics and photonics community.

Visit Heidelberg Instruments at booth 4206!

This exhibition will showcase the latest semiconductor materials, equipment, and related technologies. With special features including Semiconductor Technology Symposium, Market Trend Forum and Supplier Search Program.

Visit us at Booth B506!

SPIE Advanced Lithography + Patterning is the event focused on optical lithography, metrology, and EUV.

Visit us at Booth 209!

Talks in the conference program by Heidelberg Instruments technical experts:

Dr. Emine Cagin: “A new generation in thermal nanolithography: Combining laser writing and parallelized t-SPL with the NanoFrazor.””
24 February 2025, (DATE CONFIRMED; TIME TBC)

Dr. Benedikt Stender: “Advances in 3D nanoprinting: Increasing throughput by 100x and beyond.”
24 February 2025, (DATE CONFIRMED; TIME TBC)

Join us at the 9th Nano-Micro-Lithography Symposium! The Nano-Micro-Lithography Symposium 2025 will be held as an in-person event at the TU Eindhoven in the Netherlands.

NMLS brings together technical experts, customers, and users from Heidelberg Instruments, Nanoscribe, micro resist technology and GenISys. Two high-level keynotes will highlight the prospects and technical potential of nano-micro lithography.

The American Physical Society’s Joint March Meeting and April Meeting: Global Physics Summit 2025

Visit us at Booth # 505!

SEMICON China connects you to the world’s fastest growing and most dynamic microelectronics market, and gives you the platform to showcase your products, technologies, and brand in front of the most qualified audience of industry professionals in China.

Heidelberg Instruments will be represented by Stella International Corporation Limited.

Registration will be opened soon.

The Thermal Probe Workshop brings together nanofabrication experts and enthusiasts from all over the world for two days of talks, posters and discussions in Zürich, Switzerland. Nanostructures, through creative fabrication methods and a variety of applications, will be presented in a series of talks and poster presentations. The workshop leaves ample time for in-depth discussions inspired by the talks and posters.

SEMICON Southeast Asia has become an important exposition for the electronics industry in Southeast Asia. The show connects the decision makers from the industry, demonstrates the most advanced products and brings in the most up-to-date market and technology trends.

Heidelberg Instruments will be represented by Regional Business Network (RBN) Singapore.

Visit RBN at Booth #B1820!

2025 IEEE 75th Electronic Components and Technology Conference

The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society.

Visit us at Booth 206!

It is once again the largest-ever SEMICON Taiwan in its own history, with over 1,100 exhibitors from 25 countries using more than 3,700 booths, and attracting 85,000 visitors.

Heidelberg Instruments will be represented by Stella International Corporation Limited.