VPG+ 200 / VPG+400

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A powerful production tool for standard photomasks and microstructures in i-line resists

  • Product Description

  • The VPG+ 200 / VPG+ 400 Volume Pattern Generators are lithography systems designed for multipurpose mask manufacturing for i-line resists. They support all standard small to mid-sized mask sizes up to 410 x 410 mm2. Applications include mask manufacturing for MEMS, Advanced Packaging, 3D integration, LED and OLED masks, and microfluidics.

    The VPG+ features a field-proven ultra-high-speed exposure engine together with a high-power DPSS laser. Its technology combines high resolution, accuracy, and outstanding image quality with high throughput and flexible user-exchangeable writing grids.

  • Product Highlights

  • Exposure Quality

    Minimum feature down to 750 nm; CD uniformity 65 nm; stitching 60 nm; Mura correction; flexible address grids

    High Exposure Speed

    Custom-made high-speed spatial light modulator; optimized optical engine performance and data path, making it the fastest tool available on the market in its category; 14″ (400 mm) in <21 minutes

    Writing Stability

    Integrated ambient metrology, flowbox and software corrections to compensate environmental changes

    Alignment and metrology

    Metrology functions included; top side alignment of 225 nm (3s); automated global and field alignments with distortion correction; sophisticated 2D correction matrix over the write area

    Data preparation

    Easy-to-use flexible writing grids; online conversion, and advanced data optimization

    Autofocus

    Autofocus (pneumatic or optical) with dynamic compensation up to 150 µm

  • Available Modules

  • Variable Stage Dimensions

    Accommodate substrates up to 205 mm or 410 mm

    Three exchangable Write Modes

    User exchangable Write Modes for resolutions from 750 nm to 2 µm (optional high-quality mode)

    Automatic mask handling options

    Full automatic handling of photomasks up to 9 x 9“ (other sizes on request)

    High accuracy package

    Including Zerodur® stage, differential interferometer and advanced stage controller

    Custom substrates

    Support of custom substrates on request

    Service Contracts

    Worldwide Service-Level Agreements for faster on-site support and access to spare parts

The VPG+ 200 / VPG+ 400 Volume Pattern Generators are lithography systems designed for multipurpose mask manufacturing for i-line resists. They support all standard small to mid-sized mask sizes up to 410 x 410 mm2. Applications include mask manufacturing for MEMS, Advanced Packaging, 3D integration, LED and OLED masks, and microfluidics.

The VPG+ features a field-proven ultra-high-speed exposure engine together with a high-power DPSS laser. Its technology combines high resolution, accuracy, and outstanding image quality with high throughput and flexible user-exchangeable writing grids.

Exposure Quality

Minimum feature down to 750 nm; CD uniformity 65 nm; stitching 60 nm; Mura correction; flexible address grids

High Exposure Speed

Custom-made high-speed spatial light modulator; optimized optical engine performance and data path, making it the fastest tool available on the market in its category; 14″ (400 mm) in <21 minutes

Writing Stability

Integrated ambient metrology, flowbox and software corrections to compensate environmental changes

Alignment and metrology

Metrology functions included; top side alignment of 225 nm (3s); automated global and field alignments with distortion correction; sophisticated 2D correction matrix over the write area

Data preparation

Easy-to-use flexible writing grids; online conversion, and advanced data optimization

Autofocus

Autofocus (pneumatic or optical) with dynamic compensation up to 150 µm

Variable Stage Dimensions

Accommodate substrates up to 205 mm or 410 mm

Three exchangable Write Modes

User exchangable Write Modes for resolutions from 750 nm to 2 µm (optional high-quality mode)

Automatic mask handling options

Full automatic handling of photomasks up to 9 x 9“ (other sizes on request)

High accuracy package

Including Zerodur® stage, differential interferometer and advanced stage controller

Custom substrates

Support of custom substrates on request

Service Contracts

Worldwide Service-Level Agreements for faster on-site support and access to spare parts

Customer applications

A full 150-mm-wafer filled with a hexagonal pillar array. In such 2D replication master, no visible stitching errors are allowed. The resulting circular structures have a diameter of around 1.7 μm at the top and around 3 μm at the pitch. (Courtesy of IMS Chips)
A full 150-mm-wafer filled with a hexagonal pillar array. In such 2D replication master, no visible stitching errors are allowed. The resulting circular structures have a diameter of around 1.7 μm at the top and around 3 μm at the pitch. (Courtesy of IMS Chips)
8-level quartz Diffractive Optical Element (DOE) exposed using VPG+ system. The pixels are about 2 μm in size, the array of devices covers an area of about 20 mm. (Courtesy of IMS Chips)
8-level quartz Diffractive Optical Element (DOE) exposed using VPG+ system. The pixels are about 2 μm in size, the array of devices covers an area of about 20 mm. (Courtesy of IMS Chips)
The IMS Gate Forest® technology is a “sea-of-gates” mixed-signal gate array integrating analog and digital functionality on a single chip. The microelectronic elements on the master can be individually configured by adding the respective contacts. In a Mix&Match-approach, stepper lithography patterned the CMOS masters, and personalized contacts and metallization layers were added using VPG+ 400 laser lithography. (Courtesy of IMS Chips)
The IMS Gate Forest® technology is a “sea-of-gates” mixed-signal gate array integrating analog and digital functionality on a single chip. The microelectronic elements on the master can be individually configured by adding the respective contacts. In a Mix&Match-approach, stepper lithography patterned the CMOS masters, and personalized contacts and metallization layers were added using VPG+ 400 laser lithography. (Courtesy of IMS Chips)
The VPG+ 200 and VPG+ 400 present the solution to fabricate high-quality photomasks required for advanced packaging applications. For some applications, e.g., Through-Silicon Via (TSV) for 3D-integrated circuits, direct write lithography is currently the only available advanced packaging solution. The VPG+ 200 and the VPG+ 400 maskless lithography systems offer high speed, automatic distortion compensation and excellent resolution in order to master these applications.
The VPG+ 200 and VPG+ 400 present the solution to fabricate high-quality photomasks required for advanced packaging applications. For some applications, e.g., Through-Silicon Via (TSV) for 3D-integrated circuits, direct write lithography is currently the only available advanced packaging solution. The VPG+ 200 and the VPG+ 400 maskless lithography systems offer high speed, automatic distortion compensation and excellent resolution in order to master these applications.
Waveguides for Photonics applications created using Mix-and-Match-approach with both e-beam and laser lithography. (Courtesy of IMS Chips)
Waveguides for Photonics applications created using Mix-and-Match-approach with both e-beam and laser lithography. (Courtesy of IMS Chips)
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Technical Data

Write modeI-QXIIIIII
Writing performance
Minimum structure size [μm]0.750.7512
Minimum lines and spaces [µm]1.51.524
Address grid [nm]12.512.52550
Edge roughness [3σ, nm]30405070
CD uniformity [3σ, nm]556575110
Stitching stability [3σ, nm]306070100
2nd layer alignment [nm]225225350500
Write speed [mm²/min] 48597031506400
Exposure time for 100 x 100 mm2 area [min]28145.63.5
System features
Light sourceHigh-power DPSS laser with 355 nm
Maximum substrate sizes9″ x 9″ / 17″ x 17″
Substrate thickness0 to 12 mm (other thicknesses on request)
Maximum exposure area205 x 205 mm2 / 410 x 410 mm2
AutofocusRealtime autofocus system (optical and pneumatic)
Autofocus compensation rangeUp to 80 µm
Flowbox(Closed-loop) temperature controlled environmental chamber
Alignment Camera system and software package for metrology and alignment
Other features and options2D Stage map and data, Mura correction, edge detector, multiple data input formats (DXF, CIF, GDSII, Gerber, and others), optional automatic mask handling, optional Zerodur® stage and special chucks
System dimensions
System / Electronic rack
Width [mm]2605 / 800
Depth [mm]1652 / 650
Height [mm]2102 / 1800
Weight [kg]3550 / 180
Installation requirements
Electrical400 VAC ± 5 %, 50/60 Hz, 16 A, 3 phases
Compressed air6 - 10 bar

Please note
Specifications depend on individual process conditions and may vary according to equipment configuration. Write speed depends on pixel size and write mode. Design and specifications are subject to change without prior notice.

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