A powerful production tool for standard photomasks and microstructures in i-line resists
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Product Description
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The VPG+ 200 / VPG+ 400 Volume Pattern Generators are direct laser lithography systems designed for i-line resist applications on small and mid-size subtrates up to 410 x 410 mm2. Applications include product prototyping, MEMS, advanced packaging, 3D integration, LED and OLED production, microfluidics, and compound semiconductors.
The VPG+ features an ultra-high-speed exposure engine and automated alignment, both specifically developed for the VPG+ 200/ VPG+ 400 systems. This field-proven technology combines high resolution, outstanding image quality, and fast throughput. Stabilization of writing conditions ensures mask-to-mask reproducibility and compensates for any variations during long exposures.
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Product Highlights
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Exposure Quality
Edge roughness 40 nm; CD uniformity 65 nm; Mura correction; edge detectionHigh Exposure Speed
Custom-made high-speed spatial light modulator; optimized optical engine performance and data path, making it the fastest tool available on the market in its category; 14″ (400 mm) in <21 minutesWriting Stability
Integrated metrology system with flowbox and software correction to compensate for any variations in environmental parametersAlignment Accuracy
2nd layer alignment 225 nm; autofocus compensation range 80 µm; stitching 60 nmAutomated Alignment
Automated global and field alignment with distortion correction. Sophisticated 2D correction matrix for stage position calibration -
Available Modules
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Variable Stage Dimensions
Accommodate substrates up to 205 mm or 410 mm3 Write Modes
Resolution varying from 750 nm to 2 µmLaser Source
355 nm laser for exposing i-line resists such as SU-8 and IP 3600. 532 nm laser for writing emulsion photomasksCustomization
Backside alignment, infrared alignment, special substrate handling on requestService Contracts
Service Level Agreements for faster on-site support and access to spare parts
The VPG+ 200 / VPG+ 400 Volume Pattern Generators are direct laser lithography systems designed for i-line resist applications on small and mid-size subtrates up to 410 x 410 mm2. Applications include product prototyping, MEMS, advanced packaging, 3D integration, LED and OLED production, microfluidics, and compound semiconductors.
The VPG+ features an ultra-high-speed exposure engine and automated alignment, both specifically developed for the VPG+ 200/ VPG+ 400 systems. This field-proven technology combines high resolution, outstanding image quality, and fast throughput. Stabilization of writing conditions ensures mask-to-mask reproducibility and compensates for any variations during long exposures.
Exposure Quality
High Exposure Speed
Writing Stability
Alignment Accuracy
Automated Alignment
Variable Stage Dimensions
3 Write Modes
Laser Source
Customization
Service Contracts
Customer applications
Technical Data
Write mode | I | II | III |
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Writing performance | |||
Minimum structure size [μm] | 0.75 | 1 | 2 |
Address grid [nm] | 12.5 | 25 | 50 |
Edge roughness [3σ, nm] | 40 | 50 | 70 |
CD uniformity [3σ, nm] | 65 | 75 | 110 |
Stitching [3σ, nm] | 60 | 70 | 100 |
2nd layer alignment [3σ, nm] | 225 | 350 | 500 |
Write speed [mm²/min] | 970 | 3150 | 6400 |
System features | ||
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Light source | High-power DPSS laser with 355 nm | |
Maximum substrate sizes | 9″ x 9″ / 17″ x 17″ | |
Substrate thickness | 0 to 12 mm (other thicknesses on request) | |
Maximum exposure area | 205 x 205 mm2 / 410 x 410 mm2 | |
Autofocus | Realtime autofocus system (optical and pneumatic) | |
Autofocus compensation range | Up to 150 µm | |
Flowbox | (Closed-loop) temperature controlled environmental chamber | |
Alignment | Camera system for metrology and alignment; backside and IR alignment options | |
Other features and options | Stage map correction, Mura correction, Edge detector system, Multiple data input formats (DXF, CIF, GDSII and Gerber files); full automatic wafer and mask handling options including prealigner, optional Zerodur™ stage and special chucks | |
System dimensions | ||
System / Electronic rack | ||
Width [mm] | 2605 / 800 | |
Depth [mm] | 1652 / 650 | |
Height [mm] | 2102 / 1800 | |
Weight [kg] | 3000 / 180 | |
Installation requirements | ||
Electrical | 400 VAC ± 5 %, 50/60 Hz, 32 A | |
Compressed air | 6 - 10 bar |
Please note
Specifications depend on individual process conditions and may vary according to equipment configuration. Write speed depends on pixel size and write mode. Design and specifications are subject to change without prior notice.