Semiconductors

Empowering Semiconductor innovation: Heidelberg Instruments' precision lithography tools

  • Description

  • Semiconductors are characterized by their ability to vary their electrical conductivity when exposed to external factors like voltage, heat, or light. They serve as a foundation for electronic devices in modern technology. Semiconductor devices are constructed on wafers composed of a variety of materials. Some wafers consist of a single element, such as silicon, while others incorporate a blend of elements, forming complex crystalline structures with unique electronic properties, as seen in compound semiconductors.

    Photolithography is a pivotal process in semiconductor manufacturing that utilizes masks or direct writing techniques to transfer precise patterns onto wafers. It plays a crucial role in defining the intricate structures that form the basis of integrated circuits and other semiconductor devices.

    Heidelberg Instruments offers tools that are suited to several critical processes during the fabrication of semiconductor-based devices, from reticles demanding high precision and high uniformity to high-throughput maskless exposures with adaptive patterning. These laser lithography tools offer versatility by enabling direct writing on photoresist-coated surfaces, facilitating rapid prototyping and customization. Their precision in alignment supports multi-layer device production and can correct for individual die misalignment and deformation. This also makes them suitable for semiconductor packaging.

  • Requirements

  • High-quality resists

    High uniformity and consistency

    High throughput

    Compatibility with existing processes

    Alignment and overlay accuracy

  • Solutions

  • Laser with excellent TEM00 qualified

    for typical semiconductors resists (ULTRA & VPG+)

    Environmental control:

    metrology system with self-calibration

    Interferometric position measurement:

    real-time stage map correction

    2nd layer alignment < 100 nm

    (ULTRA)

    Warped substrate handling

    (MLA 300)

Semiconductors are characterized by their ability to vary their electrical conductivity when exposed to external factors like voltage, heat, or light. They serve as a foundation for electronic devices in modern technology. Semiconductor devices are constructed on wafers composed of a variety of materials. Some wafers consist of a single element, such as silicon, while others incorporate a blend of elements, forming complex crystalline structures with unique electronic properties, as seen in compound semiconductors.

Photolithography is a pivotal process in semiconductor manufacturing that utilizes masks or direct writing techniques to transfer precise patterns onto wafers. It plays a crucial role in defining the intricate structures that form the basis of integrated circuits and other semiconductor devices.

Heidelberg Instruments offers tools that are suited to several critical processes during the fabrication of semiconductor-based devices, from reticles demanding high precision and high uniformity to high-throughput maskless exposures with adaptive patterning. These laser lithography tools offer versatility by enabling direct writing on photoresist-coated surfaces, facilitating rapid prototyping and customization. Their precision in alignment supports multi-layer device production and can correct for individual die misalignment and deformation. This also makes them suitable for semiconductor packaging.

High-quality resists

High uniformity and consistency

High throughput

Compatibility with existing processes

Alignment and overlay accuracy

Laser with excellent TEM00 qualified

for typical semiconductors resists (ULTRA & VPG+)

Environmental control:

metrology system with self-calibration

Interferometric position measurement:

real-time stage map correction

2nd layer alignment < 100 nm

(ULTRA)

Warped substrate handling

(MLA 300)

Application images

suitable Systems

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