Semiconductors

Empowering Semiconductor innovation: Heidelberg Instruments' precision lithography tools

Description
Semiconductors are characterized by their ability to vary their electrical conductivity when exposed to external factors like voltage, heat, or light. They serve as a foundation for electronic devices in modern technology. Semiconductor devices are constructed on wafers composed of a variety of materials. Some wafers consist of a single element, such as silicon, while others incorporate a blend of elements, forming complex crystalline structures with unique electronic properties, as seen in compound semiconductors.

Photolithography is a pivotal process in semiconductor manufacturing that utilizes masks or direct writing techniques to transfer precise patterns onto wafers. It plays a crucial role in defining the intricate structures that form the basis of integrated circuits and other semiconductor devices.

Heidelberg Instruments offers tools that are suited to several critical processes during the fabrication of semiconductor-based devices, from reticles demanding high precision and high uniformity to high-throughput maskless exposures with adaptive patterning. These laser lithography tools offer versatility by enabling direct writing on photoresist-coated surfaces, facilitating rapid prototyping and customization. Their precision in alignment supports multi-layer device production and can correct for individual die misalignment and deformation. This also makes them suitable for semiconductor packaging.
Requirements
High-quality resists

High uniformity and consistency

High throughput

Compatibility with existing processes

Alignment and overlay accuracy
Solutions
Laser with excellent TEM₀₀ qualified

for typical semiconductors resists (ULTRA & VPG⁺)

Environmental control:

metrology system with self-calibration

Interferometric position measurement:

real-time stage map correction

2^nd layer alignment < 100 nm

(ULTRA)

Warped substrate handling

(MLA 300)

Semiconductors are characterized by their ability to vary their electrical conductivity when exposed to external factors like voltage, heat, or light. They serve as a foundation for electronic devices in modern technology. Semiconductor devices are constructed on wafers composed of a variety of materials. Some wafers consist of a single element, such as silicon, while others incorporate a blend of elements, forming complex crystalline structures with unique electronic properties, as seen in compound semiconductors.

Photolithography is a pivotal process in semiconductor manufacturing that utilizes masks or direct writing techniques to transfer precise patterns onto wafers. It plays a crucial role in defining the intricate structures that form the basis of integrated circuits and other semiconductor devices.

Heidelberg Instruments offers tools that are suited to several critical processes during the fabrication of semiconductor-based devices, from reticles demanding high precision and high uniformity to high-throughput maskless exposures with adaptive patterning. These laser lithography tools offer versatility by enabling direct writing on photoresist-coated surfaces, facilitating rapid prototyping and customization. Their precision in alignment supports multi-layer device production and can correct for individual die misalignment and deformation. This also makes them suitable for semiconductor packaging.

High-quality resists

High uniformity and consistency

High throughput

Compatibility with existing processes

Alignment and overlay accuracy

Laser with excellent TEM₀₀ qualified

for typical semiconductors resists (ULTRA & VPG⁺)

Environmental control:

metrology system with self-calibration

Interferometric position measurement:

real-time stage map correction

2^nd layer alignment < 100 nm

(ULTRA)

Warped substrate handling

(MLA 300)

Application images

A 6025 reticle mask on a quartz substrate, semiconductor lithography — Chrome on Quartz plate with lines & spaces written by ULTRA

CMOS master with a personalized contacts layer, used in semiconductor lithography applications — Personalized contacts layer on prefabricated CMOS master, contact on poly-Si (light colour) and contacts on p-/n-well (dark colour) (VPG 300 DI)

Semiconductor lithography example: Personalized contacts layer and metalized lines on prefabricated CMOS master (VPG 300 DI) — Personalized contacts layer and metalized lines on prefabricated CMOS master (VPG 300 DI)

SEM image of structures created with IP3250 and 1µm thickness, made with semiconductor lithography — Structures created with IP3250 (1μm thickness) Image courtesy of IMS Chips

Flexible chip film patch, laser cut, separated from a 150 mm wafer (total layer thickness: 35 µm - 65 µm, chip thickness ≈ 30 µm) Image courtesy of IMS Chips, made with semiconductor lithography — Flexible chip film patch, laser cut, separated from a 150 mm wafer (total layer thickness: 35 µm - 65 µm, chip thickness ≈ 30 µm) Image courtesy of IMS Chips

Vias with diameters 1µm, 1.25µm & 1.5µm (VPG+ exposure on Chrome Mask), might be used in semiconductor lithography — Vias with diameters 1µm, 1.25µm & 1.5µm (VPG+ exposure on Chrome Mask)

suitable Systems

MLA 300

Maskless Aligner

Optimized for flexible industrial production with highest precision and seamless integration into industrial production lines.

VPG⁺ 200, VPG⁺ 400, and VPG⁺ 800

Volume Pattern Generator

Powerful production tools for standard photomasks and microstructures in i-line resists.

VPG⁺ 1400 FPD

Volume Pattern Generator

Photomask production on large substrates, perfect for display applications.

VPG 300 DI

Maskless Stepper

Maskless direct imager for high-accuracy and high-resolution microstructures.

ULTRA

Laser Mask Writer

A tool specifically designed to produce mature semiconductor photomasks.

Semiconductors

Empowering Semiconductor innovation: Heidelberg Instruments' precision lithography tools

High-quality resists

High uniformity and consistency

High throughput

Compatibility with existing processes

Alignment and overlay accuracy

Laser with excellent TEM₀₀ qualified

Environmental control:

Interferometric position measurement:

2^nd layer alignment < 100 nm

Warped substrate handling

High-quality resists

High uniformity and consistency

High throughput

Compatibility with existing processes

Alignment and overlay accuracy

Laser with excellent TEM₀₀ qualified

Environmental control:

Interferometric position measurement:

2^nd layer alignment < 100 nm

Warped substrate handling

Application images

suitable Systems

MLA 300

VPG⁺ 200, VPG⁺ 400, and VPG⁺ 800

VPG⁺ 1400 FPD

VPG 300 DI

ULTRA

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Semiconductors

Empowering Semiconductor innovation: Heidelberg Instruments' precision lithography tools

High-quality resists

High uniformity and consistency

High throughput

Compatibility with existing processes

Alignment and overlay accuracy

Laser with excellent TEM00 qualified

Environmental control:

Interferometric position measurement:

2nd layer alignment < 100 nm

Warped substrate handling

High-quality resists

High uniformity and consistency

High throughput

Compatibility with existing processes

Alignment and overlay accuracy

Laser with excellent TEM00 qualified

Environmental control:

Interferometric position measurement:

2nd layer alignment < 100 nm

Warped substrate handling

Application images

suitable Systems

MLA 300

VPG+ 200, VPG+ 400, and VPG+ 800

VPG+ 1400 FPD

VPG 300 DI

ULTRA

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APPLICATIONS

CORE TECHNOLOGIES

KEY FEATURES

PRODUCTS

LIBRARY

SERVICE

NEWS & EVENTS

COMPANY

Laser with excellent TEM₀₀ qualified

2^nd layer alignment < 100 nm

Laser with excellent TEM₀₀ qualified

2^nd layer alignment < 100 nm

VPG⁺ 200, VPG⁺ 400, and VPG⁺ 800

VPG⁺ 1400 FPD