Advanced Packaging

CONTACT

Wafer Level Packaging and System-In-Package

  • Description

  • The final stage of semiconductor device fabrication for electronics manufacturing involves Advanced Packaging of the integrated circuit (IC) to encapsulate it in a supporting case, known as a “package”. This package provides support for the electrical contacts that connect the IC to a circuit board. Different integrated circuits in the semiconductor industry require various packaging types based on parameters like size, power dissipation, field-operating conditions, and costs. Advanced Packaging technologies include BGA, Flip-Chip, CSP, LGA, and PGA, as well as multi-chip modules, systems-in-package, and heterogeneous integration, which offer higher integration densities than conventional PCBs.

    These packaging methods offer different benefits such as speed, cost, functionality, and ease of integration for system designers. Depending on the packaging method and technical requirements, various materials need to be structured to implement the necessary fan-out and mapping of the IC contact pads. These materials, including silicon (TSVs), polymers, ceramics, and metals, all play a vital role in flexible and high-resolution lithography.

    Heidelberg Instruments’ MLA 300 and VPG+ systems are designed for flexible production applications and offer high throughput, automatic distortion compensation, and auto-focus following for substrates with low planarity. These systems can structure various materials to implement the required fan-out and mapping of IC contact pads, allowing for the production of high-quality advanced packages that meet different packaging requirements for various integrated circuits in the semiconductor industry.

    Find out more about the systems by visiting their product pages listed below.

  • Requirements

  • High throughput to reduce production time and cost

    High availability and reliability to maximize uptime

    High resolution (1 - 2 µm) for devices and back-end processes

    High CD uniformity to ensure device consistency

    High alignment accuracy to optimize yield

    Accomodating various substrate materials, warpage, thicknesses, and sizes

    Automatic distortion correction to compensate for distortions introduced by the different materials and the bonded devices

  • Solutions

  • Simultaneous exposure

    of up to 4 million pixels for production grade throughput (MLA300)

    Fast setup time & flexibility

    for small and medium production batches

    Automatic distortion correction

    to increase yield by compensating distortions from other fabrication steps

    Field-proven technology

    for high availability, manufacturing stability and reliability

The final stage of semiconductor device fabrication for electronics manufacturing involves Advanced Packaging of the integrated circuit (IC) to encapsulate it in a supporting case, known as a “package”. This package provides support for the electrical contacts that connect the IC to a circuit board. Different integrated circuits in the semiconductor industry require various packaging types based on parameters like size, power dissipation, field-operating conditions, and costs. Advanced Packaging technologies include BGA, Flip-Chip, CSP, LGA, and PGA, as well as multi-chip modules, systems-in-package, and heterogeneous integration, which offer higher integration densities than conventional PCBs.

These packaging methods offer different benefits such as speed, cost, functionality, and ease of integration for system designers. Depending on the packaging method and technical requirements, various materials need to be structured to implement the necessary fan-out and mapping of the IC contact pads. These materials, including silicon (TSVs), polymers, ceramics, and metals, all play a vital role in flexible and high-resolution lithography.

Heidelberg Instruments’ MLA 300 and VPG+ systems are designed for flexible production applications and offer high throughput, automatic distortion compensation, and auto-focus following for substrates with low planarity. These systems can structure various materials to implement the required fan-out and mapping of IC contact pads, allowing for the production of high-quality advanced packages that meet different packaging requirements for various integrated circuits in the semiconductor industry.

Find out more about the systems by visiting their product pages listed below.

High throughput to reduce production time and cost

High availability and reliability to maximize uptime

High resolution (1 - 2 µm) for devices and back-end processes

High CD uniformity to ensure device consistency

High alignment accuracy to optimize yield

Accomodating various substrate materials, warpage, thicknesses, and sizes

Automatic distortion correction to compensate for distortions introduced by the different materials and the bonded devices

Simultaneous exposure

of up to 4 million pixels for production grade throughput (MLA300)

Fast setup time & flexibility

for small and medium production batches

Automatic distortion correction

to increase yield by compensating distortions from other fabrication steps

Field-proven technology

for high availability, manufacturing stability and reliability

Application images

Advanced Packaging demonstrator as simulation of chip misalignement
Shown here is a Packaging demonstrator, a simulation of chip misalignment in chrome with connector traces exposed by MLA 300 in negative resist.
Advanced Packaging: Heidelberg Instruments‘ MLA 300 enables higher interconnect densities by exposing tailored designs matching the exact position of each die
Heidelberg Instruments‘ MLA 300 enables higher interconnect densities by exposing tailored designs matching the exact position of each die.
Advanced Packaging application: 2 µm features in 3 µm resist PLC
Panel 12"x9" exposed with a VPG+ 800 with 2 µm features in 3 µm thick photoresist.
(Courtesy of Fraunhofer IZM, Panel Level Consortium 2.0)
Advanced Packaging: the VPG+ 400 enables the production of ultra-high density polymer RDL
The VPG+ 400 enables the production of Ultra-High Density Polymer RDL* (RDL1st **FO-WLP).
(Courtesy of Fraunhofer IZM - ASSID)
*Redistribution Line / ** Fan-out Wafer-Level Packaging
Advanced Packaging: Copper pillars, with a diameter smaller than 1 µm and an aspect ratio of approximately 4:1, used for chip-to-chip interconnects.
Copper pillars, with a diameter smaller than 1 µm and an aspect ratio of approximately 4:1, are used for chip-to-chip interconnects. Made with a VPG+ 800 after a post process step.
(Courtesy of Fraunhofer IZM, Panel Level Consortium 2.0)

suitable Systems

MLA 300 – industrial maskless aligner for production of sensors, MEMS, microfluidics, advanced packaging, displays, and more

MLA 300

  • Maskless Aligner

Optimized for flexible industrial production with highest precision and seamless integration into industrial production lines.

VPG+ 200 and VPG+ 400 – Volume Pattern Generators designed for i-line resist applications like MEMS and advanced packaging

VPG+ 200, VPG+ 400, and VPG+ 800

  • Volume Pattern Generator

Powerful production tools for standard photomasks and microstructures in i-line resists.

The VPG+ 800 and VPG+ 1400 – Large-area volume pattern generators for the display industry, for advanced packaging, and more

VPG+ 1400 FPD

  • Volume Pattern Generator

Photomask production on large substrates, perfect for display applications.

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