Advanced Packaging

Wafer Level Packaging and System-In-Package

Electronics manufacturing requires the advanced packaging of the integrated circuit (IC) as the final stage in semiconductor device fabrication. The integrated circuit is encapsulated in a supporting case, known as a “package”, which supports the electrical contacts that connect the device to a circuit board.

The large variety of integrated circuits in the semiconductor industry all have different packaging requirements. The package type for each individual device is dependent on various parameters, including size, power dissipation, field-operating conditions, and costs. These advanced packaging technologies can include BGA, Flip-Chip, CSP, LGA, and PGA.

Multi-chip modules, systems-in-package, as well as heterogeneous integration of dissimilar chips or sensors allow for higher integration densities when compared to multiple chips on a conventional PCB.

These packages offer different advantages in terms of speed, cost, functionality and ease of integration for system designers.

Depending on the packaging method and technical requirements, different materials need to be structured to implement the required fan-out and mapping of the IC contact pads. These materials can range from silicon (TSV’s) and polymers to ceramics and metals. These materials share a common purpose of being necessary for both flexible and high-resolution lithography.

Heidelberg Instruments’ VPG+ systems are designed for flexible production applications and offer high throughput, automatic distortion compensation, and auto-focus following for substrates with low planarity.

The Industrial Maskless Aligner MLA 300 enables unique maskless lithography in industrial production settings. It is an enabler for high-resolution advanced packaging, next-generation electronic components and sensors. The maskless technology allows distortion corrections to be applied individually per substrate. The real-time autofocus increases the yield for warped substrates. The customizable automatic loading unit provides a comprehensive solution for integration into existing or planned production environments.

High area throughput reduces production time and cost; high availability and reliability must be guaranteed to maximize uptime

High resolution (1 - 2 µm) for devices and back-end processes

High CD uniformity and high alignment accuracy to ensure and optimize device uniformity and yield

Flexible substrate materials, thicknesses, and sizes are required depending on the packaged devices and application

Automatic distortion correction is required to compensate for distortions introduced by the substrate material and the bonded devices

Simultaneous exposure

of up to 4 million pixels for production grade throughput

Fast setup time & flexibility

for small and medium production batches

Automatic distortion correction

to increase yield by compensating distortions from other fabrication steps

Field-proven technology

for high availability, manufacturing stability and reliability

Application images

suitable Systems

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