VPG+ 800 / VPG+ 1400

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Designed for photomask production on large substrates in display applications

  • Product Description

  • These large area VPG+ tools are tailored for high-throughput patterning of large-area wafers (from 0.8 to 1.4 m). The VPG+ 1400 is our largest system specifically designed for the display industry. It is optimal for flat panel display (FPD) applications such as TFT-arrays, color filters and ITO. These tools are also used for industrial large area photomask applications for advanced packaging, semiconductors, LEDs, and touch panel applications.

    The VPG+ series is designed for high-quality and fast exposures with extremely accurate alignment. It features a differential interferometer with a resolution down to 1.2 nm. Mura optimization ensures excellent CD uniformity and resolution. The closed-loop environmental chambers comply with the most stringent requirements for advanced photomasks fabrication. Stabilization of writing conditions ensures mask-to-mask reproducibility and compensates for any variations during long exposures. The VPG+ systems support all industrial data formats.

  • Product Highlights

  • Exposure Quality

    Edge roughness 40 nm; CD uniformity 65 nm; address grid down to 12.5 nm; Mura correction, edge detection

    Writing Stability

    Integrated metrology system with flowbox and software correction compensates for any variations in environmental parameters

    Automated Alignment

    Automated global and field-by-field alignment with distortion correction. Sophisticated 2D correction matrix for stage position calibration

    Scalability

    VPG+ platforms scale easily for all sizes from <4" to G8 photomasks 1200 x 1400 mm2

    Exposure Speed

    800 x 800 mm2 in 82 minutes; 1400 x 1400 mm2 in 238 minutes

  • Available Modules

  • Variable Stage Dimensions

    Accomodate large substrates: 800 mm / 1400 mm

    Automation

    Semi- or fully automated substrate loading; write-mode exchanger unit; Mura and panel pitch optimization

    Customization

    Special substrates, loader, mask handling, on request

These large area VPG+ tools are tailored for high-throughput patterning of large-area wafers (from 0.8 to 1.4 m). The VPG+ 1400 is our largest system specifically designed for the display industry. It is optimal for flat panel display (FPD) applications such as TFT-arrays, color filters and ITO. These tools are also used for industrial large area photomask applications for advanced packaging, semiconductors, LEDs, and touch panel applications.

The VPG+ series is designed for high-quality and fast exposures with extremely accurate alignment. It features a differential interferometer with a resolution down to 1.2 nm. Mura optimization ensures excellent CD uniformity and resolution. The closed-loop environmental chambers comply with the most stringent requirements for advanced photomasks fabrication. Stabilization of writing conditions ensures mask-to-mask reproducibility and compensates for any variations during long exposures. The VPG+ systems support all industrial data formats.

Exposure Quality

Edge roughness 40 nm; CD uniformity 65 nm; address grid down to 12.5 nm; Mura correction, edge detection

Writing Stability

Integrated metrology system with flowbox and software correction compensates for any variations in environmental parameters

Automated Alignment

Automated global and field-by-field alignment with distortion correction. Sophisticated 2D correction matrix for stage position calibration

Scalability

VPG+ platforms scale easily for all sizes from <4" to G8 photomasks 1200 x 1400 mm2

Exposure Speed

800 x 800 mm2 in 82 minutes; 1400 x 1400 mm2 in 238 minutes

Variable Stage Dimensions

Accomodate large substrates: 800 mm / 1400 mm

Automation

Semi- or fully automated substrate loading; write-mode exchanger unit; Mura and panel pitch optimization

Customization

Special substrates, loader, mask handling, on request

Customer applications

Since 2007, VPG systems and their successors, the VPG+ systems, proved to be the ideal solution for the high-volume production of demanding photomasks ⁠— especially for electronic packaging, color filters, light emitting diodes, and touch panels. As a master template for photolithographic manufacturing, such photomasks have to fulfill highest requirements for the line width uniformity, pattern position accuracy, edge roughness and minimum feature size.
Since 2007, VPG systems and their successors, the VPG+ systems, proved to be the ideal solution for the high-volume production of demanding photomasks ⁠— especially for electronic packaging, color filters, light emitting diodes, and touch panels. As a master template for photolithographic manufacturing, such photomasks have to fulfill highest requirements for the line width uniformity, pattern position accuracy, edge roughness and minimum feature size.
The VPG+ series can be used for all display-related applications. In this field, the quality requirements on photomasks are exceptional. One key specification is the so-called Mura condition, describing "unevenness" as a result of any disturbance in a regular periodic pattern. If Mura condition fails to meet the requirements, the final display might havedark spots or patches. The VPG+ series of Maskless Lithography Systems offer special Mura optimization function for good Mura condition and excellent CD uniformity and resolution.
The VPG+ series can be used for all display-related applications. In this field, the quality requirements on photomasks are exceptional. One key specification is the so-called Mura condition, describing "unevenness" as a result of any disturbance in a regular periodic pattern. If Mura condition fails to meet the requirements, the final display might havedark spots or patches. The VPG+ series of Maskless Lithography Systems offer special Mura optimization function for good Mura condition and excellent CD uniformity and resolution.
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Why customers choose our systems

The VPG+ 800 allows us to realize copper lines and chip-to-chip interconnects with a size down to 1 µm. Which is a three times smaller feature size than by using the conventional mask aligner process.

Markus Wöhrmann, Group leader Lithography and Thin Film Polymers for Wafer Level Packaging
Fraunhofer Institute for Microintegration and Reliability
Berlin, Germany

Technical Data

Write modeIIIIII
Writing performance
Minimum structure size [μm]0.7512
Address grid [nm]12.52550
Edge roughness [3σ, nm]405070
CD uniformity [3σ, nm]6575110
Plate-to-plate overlay [3σ, nm] VPG+ 800160160220
Plate-to-plate overlay [3σ, nm] VPG+ 1400250250300
Stitching [3σ, nm]6070100
Registration [3σ, nm]200200200
Write speed [mm²/min] VPG+ 800110039257825
Write speed [mm²/min] VPG+ 1400112541258250
System features
Light sourceHigh-power DPSS laser with 355 nm
Maximum substrate sizes800 x 800 mm² / 1400 x 1400 mm²
Substrate thickness0 to 13.2 mm
Maximum exposure area800 x 800 mm² / 1400 x 1400 mm²
AutofocusRealtime autofocus system (optical and pneumatic)
Autofocus compensation range150 µm
AutomationSemi-automatic loading system
FlowboxClosed-loop temperature controlled environmental chamber
Alignment Camera system for metrology and alignment
Other features and optionsStage map correction, Mura and panel pitch optimization, Edge detector system, Multiple data input formats (DXF, CIF, GDSII and Gerber files), automatic writemode changer; options for emulsion
System dimensions
Main unit (doors closed, loader extended)VPG+ 800 / VPG+ 1400
Width [mm]3100 / 5370
Depth [mm]4250 / 7000
Height [mm]2700 / 2800
Weight [kg]10000 / 25000
Installation requirements
Electrical400 VAC ± 5 %, 50/60 Hz, 32 A
Compressed air8 - 10 bar

Please note
Specifications depend on individual process conditions and may vary according to equipment configuration. Write speed depends on pixel size and write mode. Design and specifications are subject to change without prior notice.

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