Designed for photomask production on large substrates in display applications
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Product Description
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These large area VPG+ tools are tailored for high-throughput patterning of large-area wafers (from 0.8 to 1.4 m). The VPG+ 1400 is our largest system specifically designed for the display industry. It is optimal for flat panel display (FPD) applications such as TFT-arrays, color filters and ITO. These tools are also used for industrial large area photomask applications for advanced packaging, semiconductors, LEDs, and touch panel applications.
The VPG+ series is designed for high-quality and fast exposures with extremely accurate alignment. It features a differential interferometer with a resolution down to 1.2 nm. Mura optimization ensures excellent CD uniformity and resolution. The closed-loop environmental chambers comply with the most stringent requirements for advanced photomasks fabrication. Stabilization of writing conditions ensures mask-to-mask reproducibility and compensates for any variations during long exposures. The VPG+ systems support all industrial data formats.
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Product Highlights
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Exposure Quality
Edge roughness 40 nm; CD uniformity 65 nm; address grid down to 12.5 nm; Mura correction, edge detectionWriting Stability
Integrated metrology system with flowbox and software correction compensates for any variations in environmental parametersAutomated Alignment
Automated global and field-by-field alignment with distortion correction. Sophisticated 2D correction matrix for stage position calibrationScalability
VPG+ platforms scale easily for all sizes from <4" to G8 photomasks 1200 x 1400 mm2Exposure Speed
800 x 800 mm2 in 82 minutes; 1400 x 1400 mm2 in 238 minutes -
Available Modules
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Variable Stage Dimensions
Accomodate large substrates: 800 mm / 1400 mmAutomation
Semi- or fully automated substrate loading; write-mode exchanger unit; Mura and panel pitch optimizationCustomization
Special substrates, loader, mask handling, on request
These large area VPG+ tools are tailored for high-throughput patterning of large-area wafers (from 0.8 to 1.4 m). The VPG+ 1400 is our largest system specifically designed for the display industry. It is optimal for flat panel display (FPD) applications such as TFT-arrays, color filters and ITO. These tools are also used for industrial large area photomask applications for advanced packaging, semiconductors, LEDs, and touch panel applications.
The VPG+ series is designed for high-quality and fast exposures with extremely accurate alignment. It features a differential interferometer with a resolution down to 1.2 nm. Mura optimization ensures excellent CD uniformity and resolution. The closed-loop environmental chambers comply with the most stringent requirements for advanced photomasks fabrication. Stabilization of writing conditions ensures mask-to-mask reproducibility and compensates for any variations during long exposures. The VPG+ systems support all industrial data formats.
Exposure Quality
Writing Stability
Automated Alignment
Scalability
Exposure Speed
Variable Stage Dimensions
Automation
Customization
Customer applications
Why customers choose our systems
Markus Wöhrmann, Group leader Lithography and Thin Film Polymers for Wafer Level Packaging
Fraunhofer Institute for Microintegration and Reliability
Berlin, Germany
Technical Data
Write mode | I | II | III |
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Writing performance | |||
Minimum structure size [μm] | 0.75 | 1 | 2 |
Address grid [nm] | 12.5 | 25 | 50 |
Edge roughness [3σ, nm] | 40 | 50 | 70 |
CD uniformity [3σ, nm] | 65 | 75 | 110 |
Plate-to-plate overlay [3σ, nm] VPG+ 800 | 160 | 160 | 220 |
Plate-to-plate overlay [3σ, nm] VPG+ 1400 | 250 | 250 | 300 |
Stitching [3σ, nm] | 60 | 70 | 100 |
Registration [3σ, nm] | 200 | 200 | 200 |
Write speed [mm²/min] VPG+ 800 | 1100 | 3925 | 7825 |
Write speed [mm²/min] VPG+ 1400 | 1125 | 4125 | 8250 |
System features | |
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Light source | High-power DPSS laser with 355 nm |
Maximum substrate sizes | 800 x 800 mm² / 1400 x 1400 mm² |
Substrate thickness | 0 to 13.2 mm |
Maximum exposure area | 800 x 800 mm² / 1400 x 1400 mm² |
Autofocus | Realtime autofocus system (optical and pneumatic) |
Autofocus compensation range | 150 µm |
Automation | Semi-automatic loading system |
Flowbox | Closed-loop temperature controlled environmental chamber |
Alignment | Camera system for metrology and alignment |
Other features and options | Stage map correction, Mura and panel pitch optimization, Edge detector system, Multiple data input formats (DXF, CIF, GDSII and Gerber files), automatic writemode changer; options for emulsion |
System dimensions | |
Main unit (doors closed, loader extended) | VPG+ 800 / VPG+ 1400 |
Width [mm] | 3100 / 5370 |
Depth [mm] | 4250 / 7000 |
Height [mm] | 2700 / 2800 |
Weight [kg] | 10000 / 25000 |
Installation requirements | |
Electrical | 400 VAC ± 5 %, 50/60 Hz, 32 A |
Compressed air | 8 - 10 bar |
Please note
Specifications depend on individual process conditions and may vary according to equipment configuration. Write speed depends on pixel size and write mode. Design and specifications are subject to change without prior notice.