DWL 66⁺

The versatile tool for research and prototyping with variable resolution and a large selection of modules for easy customization

The DWL 66⁺ laser lithography tool is a high-resolution direct-write pattern generator. As an allrounder, the DWL 66⁺ is ideal for research and development (R&D) in microelectronics, MEMS, microfluidics, sensors, non-standard substrates, advanced packaging — virtually any academic application that requires microstructure fabrication. The DWL 66⁺ stands out with its Grayscale Exposure Mode which creates complex 2.5D microstructures such as micro-optics for mobile applications, diffractive optical elements (DOE), computer-generated holograms, and structured surfaces.

It is a highly flexible and customizable system that precisely matches the requirements of your applications. Among the key features of the DWL 66⁺ are a high-resolution mode, front- and backside alignment, absolute position calibration and an automatic loading system.

Exposure Quality

CD uniformity 60 nm; edge roughness 50 nm; 2nd layer alignment 500 nm; autofocus compensation 80 µm

Grayscale Lithography

Up to 1024 gray levels; dedicated GenISys BEAMER software for optimizing the exposure of complex geometries

Versatility

Choice of 6 write modes with 2 laser wavelengths; 3 grayscale exposure regimes; highest amount of additional modules available including automation options

6 Write Modes

Min. features from 300 nm to 4 µm

Exposure Wavelength

Diode laser at 375 nm or 405 nm

Autofocus

Air-gauge or optical autofocus for perfect exposure of small samples (less than 10 mm)

Variable substrate

Size from 3 mm to 230 mm

2 Grayscale Modes

Up to 1024 gray levels and a dedicated GenISys BEAMER software for optimizing the exposure of complex geometries

High-Accuracy Option

Various technical measures to improve the thermal stability and position accuracy of the stage’s coordinate system. Improved specifications for 2nd layer alignment: 350 nm

Automatic Loader

Handling of masks up to 7″ and substrates up to 8″. Optional second cassette station. Pre-aligner and wafer scanner available

Basic Freeform (BFF)

Exposures on non-planar substrates with features down to 3 μm. Typical applications are microstructures on top of convex or concave lenses

Vector Scan Mode

Patterns structures and shapes consisting of curved lines where smooth contours are required

Customer applications

The 300 nm wide channel waveguide coupled to a ring resonator with a radius of 3 µm was written using the high-resolution write mode HiRes on the DWL 66+. Submicron waveguides, resonators and similar microstructures are used in optoelectronics to guide or study electromagnetic radiation. This design was created with the “Nanolithography Toolbox”, K.C. Balram et al., J. Res. natl. Inst. Stand. 121, pp. 464-475 (2016). — The 300 nm wide channel waveguide coupled to a ring resonator with a radius of 3 µm was written using the high-resolution write mode HiRes on the DWL 66⁺. Submicron waveguides, resonators and similar microstructures are used in optoelectronics to guide or study electromagnetic radiation. This design was created with the “Nanolithography Toolbox”, K.C. Balram et al., J. Res. natl. Inst. Stand. 121, pp. 464-475 (2016).

Fresnel microlenses are still a crucial component in today’s micro-optics and opto-electronics. Originally invented to reduce mass and volume of lenses used in lighthouses, Fresnel microlenses manufactured by grayscale direct-write lithography are used in mobile devices, enabling ultra-light and compact powerful cameras that fit in our pockets.

This array of pseudo-random concave microlenses is used as a diffusor. Such devices modify the light distribution of a point-like source, e.g. LED. For example, in mobile devices, a diffusor is used to ensure homogeneous illumination when taking a picture with a flash.

$A diffraction grating patterned with the DWL 66+. Both the angle of the sawtooth-like profile and the groove spacing are tuned to match the specific application requirements. Blazed gratings are key components of many optical instruments, such as monochromators and spectrometers used in sensors, communication systems and other tools.$

A diffraction grating patterned with the DWL 66⁺. Both the angle of the sawtooth-like profile and the groove spacing are tuned to match the specific application requirements. Blazed gratings are key components of many optical instruments, such as monochromators and spectrometers used in sensors, communication systems and other tools. (Courtesy of IGI)

This retro-reflector structure was patterned using the DWL 66+. 2.5D micro-structures designed to control reflection or diffusion of light are used in light sources and illumination, such as backlight units in LCD displays. — This retro-reflector structure was patterned using the DWL 66⁺. 2.5D micro-structures designed to control reflection or diffusion of light are used in light sources and illumination, such as backlight units in LCD displays. (Courtesy of karmic.ch)

“Moth eye” compound microlenses array replicated with nanoimprint technology shows the DWL 66+ capabilities for 2.5D patterning. Texturing surfaces using grayscale lithography can control and modify their hydrophobicity, friction, haptics, and adhesion. — “Moth eye” compound microlenses array replicated with nanoimprint technology shows the DWL 66⁺ capabilities for 2.5D patterning. Texturing surfaces using grayscale lithography can control and modify their hydrophobicity, friction, haptics, and adhesion. (Courtesy of ShenZhen Nahum-Eli Optical Technology Inc.)

Why customers choose our systems

"Ordering a DWL 66⁺ machine during the time of the Corona pandemic was a great challenge. It turned into an advantage. Installation was in time. By remote training, we learned quickly about grayscale lithography, developed basic process knowledge with the help of three bachelor students, and jumped into our first industrial projects that gave us real-life experience and insight into the capability of our new tool. During this time, we had an intensive exchange with Heidelberg Instruments that was instrumental to go beyond the basics of 3D lithography. It is therefore easy to say that choosing the DWL 66⁺ was the right thing to do, and it complements well the other lithography techniques that we pursue at Paul Scherrer Institute."

Dr. Helmut Schift, Head of Advanced Nano Manufacturing Group
Paul Scherrer Institute (PSI)
Villigen, Switzerland

"Having had good success with the µPG 101 (ancestor of the µMLA) to make challenging diffractive-optical elements, we equipped our lab with a DWL 66⁺ in 2021. This tool is faster, has a larger writing area and provides good stability for high-resolution grayscale patterning. It enabled us to fabricate the largest flat lens made to date. The support and collaborations from Heidelberg Instruments are greatly appreciated, particularly to continuously improve the lithography processes."

Dr. Rajesh Menon, Professor
University of Utah
Salt Lake City, USA

"At our institute, DWL 66⁺ represents a bridging technology between classical mask-based photolithography, which can enable high throughput, and electron beam lithography, which guaranties very high resolution but is a slow structuring process. It is precisely here that DWL 66⁺ represents a complement to the existing structuring processes. DWL 66⁺ enables us to produce our own glass mask for conventional photolithography in-house, to carry out prototyping and to process structures in the sub-µm range with a large total area in an acceptable time."

Sascha de Wall, Research Associate, Group Leader
Institute of Micro Production Technology
Leibniz University Hanover
Hanover, Germany

Technical Data

Write mode	HiRes	I	II	III	IV	V
Writing performance
Minimum Feature Size [μm]	0.3	0.6	0.8	1	2	4
Minimum Lines and Spaces [μm]	0.5	0.8	1	1.5	3	5
Address Grid [nm]	5	10	25	50	100	200
Edge Roughness [3σ, nm]	50	50	70	80	110	160
CD Uniformity [3σ, nm]	60	70	80	130	250	400
2nd Layer Alignment over 5 x 5 mm² [nm]	250	250	250	250	350	500
2nd Layer Alignment over 100 x 100 mm² [nm]	500	500	500	500	800	1000
Backside Alignment [nm]	1000	1000	1000	1000	1000	1000
With Diode Laser (405 nm)
Write speed [mm²/min]	3	13	40	150	600	2000
Exposure Time for 100 x 100 mm² area [min]	3000	740	255	72	20	7
With UV Diode Laser (375 nm)
Write Speed [mm²/min]	2	10	30	110	-	-
Exposure Time for 100 x 100 mm² area [min]	5000	1015	350	100	-	-

System features
Light Source	Diode laser with 405 nm or 375 nm
Substrate Sizes	Variable: 5 x 5 mm² to 9″ x 9″ \| Customizable on request
Substrate Thickness	0 to 12 mm
Maximum Exposure Area	200 x 200 mm²
Temperature controlled Flow Box	Temperature stability ± 0.1°, ISO 4 environment
Real-Time Autofocus	Optical autofocus or air-gauge autofocus
Autofocus Compensation Range	80 μm
Standard or Advanced Grayscale Mode	128 / 256 gray levels respectively
Vector Mode	Enables the writing of stitching-free lines
Overview Camera	8 x 10 mm² field of view facilitates alignment to marks and substrate navigation
Backside Alignment (optional)	Allows the alignment of exposures to structures on the backside of the substrate

Advanced Options - Performance Upgrades
High-Accuracy Coordinate System	Includes golden plate calibration and climate monitoring: 2nd layer alignment down to 350 nm
Professional Grayscale Mode	1024 gray levels, professional data conversion software
Automatic Loading System	Handling of masks up to 7" and wafers up to 8" with two carrier stations, pre-aligner and wafer scanner

System Dimensions of Standard Version
Width × depth × height	1300 mm × 1100 mm × 1950 mm (lithography unit only)
Weight	1000 kg (lithography unit only)

Installation requirements
Electrical	230 VAC ± 5 %, 50/60 Hz, 16 A
Compressed air	6 - 10 bar

Please note
Specifications depend on individual process conditions and may vary according to equipment configuration. Write speed depends on pixel size and write mode. Design and specifications are subject to change without prior notice

Download BROCHURE

DWL 66⁺

The versatile tool for research and prototyping with variable resolution and a large selection of modules for easy customization

Exposure Quality

Grayscale Lithography

Versatility

6 Write Modes

Exposure Wavelength

Autofocus

Variable substrate

2 Grayscale Modes

High-Accuracy Option

Automatic Loader

Basic Freeform (BFF)

Vector Scan Mode

Exposure Quality

Grayscale Lithography

Versatility

6 Write Modes

Exposure Wavelength

Autofocus

Variable substrate

2 Grayscale Modes

High-Accuracy Option

Automatic Loader

Basic Freeform (BFF)

Vector Scan Mode

Customer applications

Why customers choose our systems

Technical Data

APPLICATIONS

CORE TECHNOLOGIES

KEY FEATURES

PRODUCTS

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DWL 66+

The versatile tool for research and prototyping with variable resolution and a large selection of modules for easy customization

Exposure Quality

Grayscale Lithography

Versatility

6 Write Modes

Exposure Wavelength

Autofocus

Variable substrate

2 Grayscale Modes

High-Accuracy Option

Automatic Loader

Basic Freeform (BFF)

Vector Scan Mode

Exposure Quality

Grayscale Lithography

Versatility

6 Write Modes

Exposure Wavelength

Autofocus

Variable substrate

2 Grayscale Modes

High-Accuracy Option

Automatic Loader

Basic Freeform (BFF)

Vector Scan Mode

Customer applications

Why customers choose our systems

Technical Data

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APPLICATIONS

CORE TECHNOLOGIES

KEY FEATURES

PRODUCTS

LIBRARY

SERVICE

NEWS & EVENTS

COMPANY

DWL 66⁺