High Aspect Ratio

Aspect Ratios of up to 40:1 in SU-8

Application areas such as MEMS, micro-fluidics, and others often require microstructures that have a high aspect ratio. Our direct write lithography systems can directly expose thick layers of resist, such as SU-8, while maintaining a vertical side wall. This is possible by adjusting the entrance pupil of the lens, which increases the DoF, thereby reducing the numerical aperture which allows for aspect ratios of up to 40:1 to be achieved. Features with ultra-high lateral resolution and aspect ratio can then be produced by etch amplification using RIE.

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