High Aspect Ratio

Aspect Ratios of up to 40:1 in SU-8

Application areas such as MEMS, micro-fluidics, and others often require microstructures that have a high aspect ratio. Our direct write lithography systems can directly expose thick layers of resist, such as SU-8, while maintaining a vertical side wall. This is possible by adjusting the entrance pupil of the lens, which increases the DoF, thereby reducing the numerical aperture which allows for aspect ratios of up to 40:1 to be achieved. Features with ultra-high lateral resolution and aspect ratio can then be produced by etch amplification using RIE.

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suitable Systems

DWL 66+ – a laser lithography tool for R&D in microelectronics, MEMS, microfluidics and more with Grayscale exposure mode

DWL 66+

  • Direct Write Laser Lithography System

Our most versatile system for research and prototyping with variable resolution and wide selection of options.

MLA 150 – a maskless lithography tool for nanofabrication of quantum devices, MEMS, micro-optics and other applications

MLA 150

  • Maskless Aligner

The fastest maskless tool for rapid prototyping, the alternative to the mask aligners. Perfect for standard binary lithography.

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