Maskless Laser Lithography
Direct Writing on the Microscale
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Description
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Traditional photolithography requires the fabrication or purchase of a photomask and then the use of a stepper or mask aligner to transfer the CAD pattern onto a resist-covered wafer or plate. This process remains the most established and cost-effective method for high-volume manufacturing of sub-micron-sized design features due to economies of scale. Heidelberg Instruments offers advanced systems like the VPG+ series and ULTRA, specifically designed for the photomask market—covering applications from mature semiconductor photomasks to electronics and FPD photomasks.
However, for many other applications, Maskless Lithography presents a powerful and sustainable alternative. This high-precision, highly flexible technology is ideal for R&D, rapid prototyping, and small-batch production with feature sizes greater than 1 µm. Maskless lithography eliminates the need for photomasks, reducing upfront costs, material waste, and chemical consumption—making it particularly advantageous for low- to mid-volume production where design flexibility and quick iteration cycles are critical.
In maskless lithography, the pattern is exposed directly onto the substrate surface using a spatial light modulator (SLM), which acts as a “dynamic photomask”. Simply upload and convert the design file, and the system handles the rest. No photomask ordering, no delays, no expensive mask iterations. As your design evolves, simply reload the file and perform new exposures in a fraction of the time required by traditional photomask-based processes.
Beyond speed and flexibility, maskless systems contribute to sustainability by minimizing material waste, energy consumption, and chemical usage, making them a responsible choice for modern microfabrication.
Discover our Maskless Aligners (MLA) and Direct Write Lithography (DWL) systems here.
Traditional photolithography requires the fabrication or purchase of a photomask and then the use of a stepper or mask aligner to transfer the CAD pattern onto a resist-covered wafer or plate. This process remains the most established and cost-effective method for high-volume manufacturing of sub-micron-sized design features due to economies of scale. Heidelberg Instruments offers advanced systems like the VPG+ series and ULTRA, specifically designed for the photomask market—covering applications from mature semiconductor photomasks to electronics and FPD photomasks.
However, for many other applications, Maskless Lithography presents a powerful and sustainable alternative. This high-precision, highly flexible technology is ideal for R&D, rapid prototyping, and small-batch production with feature sizes greater than 1 µm. Maskless lithography eliminates the need for photomasks, reducing upfront costs, material waste, and chemical consumption—making it particularly advantageous for low- to mid-volume production where design flexibility and quick iteration cycles are critical.
In maskless lithography, the pattern is exposed directly onto the substrate surface using a spatial light modulator (SLM), which acts as a “dynamic photomask”. Simply upload and convert the design file, and the system handles the rest. No photomask ordering, no delays, no expensive mask iterations. As your design evolves, simply reload the file and perform new exposures in a fraction of the time required by traditional photomask-based processes.
Beyond speed and flexibility, maskless systems contribute to sustainability by minimizing material waste, energy consumption, and chemical usage, making them a responsible choice for modern microfabrication.
Discover our Maskless Aligners (MLA) and Direct Write Lithography (DWL) systems here.
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Suitable Systems
MLA 150
- Maskless Aligner
The fastest maskless tool for rapid prototyping, the alternative to the mask aligners. Perfect for standard binary lithography.
MLA 300
- Maskless Aligner
Optimized for flexible industrial production with highest precision and seamless integration into industrial production lines.
VPG+ 200, VPG+ 400, and VPG+ 800
- Volume Pattern Generator
Powerful production tools for standard photomasks and microstructures in i-line resists.
DWL 66+
- Direct Write Laser Lithography System
Our most versatile system for research and prototyping with variable resolution and wide selection of options.
DWL 2000 GS / DWL 4000 GS
- Direct Write Laser Lithography System
The most advanced industrial grayscale lithography tool on the market.
VPG+ 1400 FPD
- Volume Pattern Generator
Photomask production on large substrates, perfect for display applications.
ULTRA
- Laser Mask Writer
A tool specifically designed to produce mature semiconductor photomasks.