Multi-user Tool for 3D Lithography and 3D Microprinting

The MPO 100 is a Two-Photon Polymerization (TPP) Multi-User Tool for 3D Lithography and 3D Microprinting of microstructures with applications in Optics, Photonics, Mechanics and Biomedical Engineering. The modular 3D printing platform MPO 100 offers high precision on demand for 3D Lithography as well as high print volume for 3D Microprinting and enables production of complex functional microstructures with high throughput in a single process step.

The MPO 100 includes a powerful femtosecond laser system operating at a wavelength of 522 nm thereby enabling efficient and high-speed processing of many commercially available polymer systems. Among those is the industry-proven class of inorganic-organic hybrid polymers known as ORMOCER®. This class of materials provides unique optical, mechanical and chemical properties. In addition, as many photoresists exhibit high sensitivity at the 522 nm TPP wavelength the MPO 100 is an ideal tool for R&D to develop new material systems.

1 – 10 – 100 – 1000
Application-specific write modes enable fast and easy switching between 3D Lithography and 3D Microprinting. Macro structures with a height of over 1 cm can be fabricated as well as micro structures with superior surface quality exhibiting a roughness of down to 10 nm. The achievable minimum feature size of down to 100 nm and the accessible scan speed of over 1000 mm/s provide full user benefit for tailored 3D nano-, micro- and macro fabrication processes.

Printing Height

Structures taller than 1 cm

Surface quality

Smooth surfaces with roughness down to 10 nm

High-Resolution Print

Feature sizes smaller than 100 nm

High-speed 3D microfabrication

High scan speeds over 1000 mm/s

Stable printing environment

Temperature controlled flowbox down to ± 0.1 °C with ISO4 environment

Large printing area

Print area of 100 mm x 100 mm

Stitching-free fabrication

Synchronized scanning system enables stitching-free fabrication

Versatility

Various exposure and write modes tailored to the specific applications

Industry-proven materials

High-speed processing of ORMOCER®s (hybrid polymers) and other photoresists

User-friendly

Optional software modules for customer-specific print jobs

Customer applications

Technical Data

Performance
Print height (max.)≥ 1 cm
Roughness (min.)≤ 10 nm
Minimum feature size ≤ 100 nm (lateral)
Scan speed (max.)10 m/s divided by magnification (e.g. 1000 mm/s for 10x)
Materials (additive or subtractive)ORMOCER®s, SU-8, customer-specific resins, AZ-series,
ma-P 1200, metal layers (e.g. Ag, Au, Cr, ...)
Structuring modesScan-and-Step with advanced stitching algorithms
Stage only for stitching-free fabrication
Synchronized Infinite Field-of-View (IFoV) for stitching-free fabrication
System features
Laserλ = (522 ± 3) nm    τpulse ≤ 250 fs    frep = (63 ± 0.6) MHz
Pmean ≥ 600 mW    Epulse > 10 nJ
Laser power at focusing optics (max.)≥ 200 mW
Focusing opticsNumerical aperture: 0.2 (air) to 1.4 (immersion)
Magnification: 5x to 100x
Field-of-View (FoV): up to 2 mm
Print area100 mm x 100 mm
AutofocusOptical detection of interfaces down to 20 nm
SubstrateSize: up to 6-inch (4-inch process area), Thickness: up to 4 cm
SoftwareLithoSoft3D (code generation software)    LithoStream (system control software)
Scanning systemSynchronized 5 axes system of XYZ stage and galvoscanner
XYZ stage:  Electromagnetic direct drive, air bearing
      Accuracy: ± 0.2 μm per axis (over full travel range)
      Repeatability: down to ± 0.05 μm per axis (over full travel range)
      Positioning stability: ≥ 5 nm
Temperature controlled flow boxControl down to ± 0.1°, ISO Class 4 cleanroom environment
System dimensions (TPP unit)
Footprint1300 mm × 1100 mm × 1950 mm
Weight< 1000 kg
Installation requirements
Electrical115/230 V, 50/60 Hz, 16 A
Optimum lab conditionsTemperature: 21 °C ± 1 °C    Humidity: 40 – 80 % non-condensing
Compressed air6 - 8 bar, stability ± 0.5 bar
Room lightingYellow light

Please note
Specifications depend on individual process conditions and may vary according to equipment configuration. Write speed depends on write mode. Design and specifications are subject to change without prior notice

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