MLA 300

Optimized for industrial manufacturing, ensuring high throughput and seamless production line integration

The Maskless Aligner MLA 300 provides high throughput, simplified workflow and integration with manufacturing execution systems (MES). This tool is used for the production of sensors and sensor ICs, MEMS and microfluidic devices. Other applications include discrete electronic components, analog and digital ICs, ASICs, power electronics, OLED displays and advanced packaging.

The MLA 300 achieves the highest optical quality and precision. The standard exposure module achieves min. feature size of 1.5 µm. Writing modes for higher throughput and higher resolution are on our roadmap. The MLA 300 features full automation with customizable loading options, software designed for production environments and a patented substrate tracking technology.

The MLA 300 reduces production costs and effort by overcoming the requirement for mask procurement, verification and management. Operating costs benefit from a long-lifetime exposure laser (est. 10 years at 24/7 production) and fewer consumables. Modularity enables fast maintenance, replacement or repair. Real-time autofocus compensates substrate warp or corrugations for flawless patterning. Maskless lithography allows per-die pattern corrections and serialization for full tracing of product characteristics, such as sensor calibration.

Direct-write Lithography

No mask-related costs, effort, or security risks

Flexibility

Direct writing in industrial production allows per-die pattern corrections, e.g. to react to distortions or process variations and serialization

Time-saving

Shorter time from prototyping to production. Digital design management replaces conventional mask library

Exposure Quality

Optical compensation of scaling, rotation; patented substrate tracking technology

Dynamic Autofocus

Superior critical dimensions (CD) uniformity on warped or corrugated substrates

Exposure Speed

300 x 300 mm² in 19 minutes

Full Facility Integration

Customizable automatic loader, substrate chuck including warped substrates, custom workflow “wizards” and interface with manufacturing execution systems (MES)

User-friendly

SEMI-compliant user interface; customized workflow “wizards” for system operators

Automated Loading Module

SEMI-standard BOLTS plane can be configured for open cassettes or Load Ports for FOUP. The number and configuration of ports can be selected and customized for round or rectangular substrates

Manufacturing Execution System (MES)

Integration Customizable workflow “wizards” to start exposure jobs, and integration to a central MES via SECS/GEM or OPC-UA protocols

Backside Alignment

Visual or through-wafer IR backside alignment available with 1 µm positioning accuracy

Exposure Wavelengths

High-power diode lasers with 7 W at 375 nm or 20 W at 405 nm with long lifetime are available

Multipurpose Vacuum Chuck

Customized vacuum chucks are available for applications with special substrates (e.g. warped panels)

Service Contracts

Service contract grades for faster on-site support and participation in the spare parts pool

Customer applications

Heidelberg Instruments‘ MLA 300 enables higher interconnect densities by exposing tailored designs matching the exact position of each die.

Resolution pattern exposed in a 500 nm layer of AZ1500 showing minimum feature size of 1.5 µm.
(SEM image, viewed with a 45° angle) — Resolution pattern exposed in a 500 nm layer of AZ1500 showing minimum feature size of 1.5 µm. (SEM image, viewed with a 45° angle)

Test structures exposed in a 10 µm layer of AZ 10XT.
(SEM image, viewed with a 45° angle) — Test structures exposed in a 10 µm layer of AZ 10XT. (SEM image, viewed with a 45° angle)

Resolution pattern exposed in a 10 µm layer of AZ 10XT showing aspect ratio of 1:5.
(SEM image, viewed with a 45° angle) — Resolution pattern exposed in a 10 µm layer of AZ 10XT showing aspect ratio of 1:5. (SEM image, viewed with a 45° angle)

Optical microscope view of a micro QR code exposed in AZ1500 (500 nm) resist.

MEMS processes integrate standard microchip technologies with electromechanical components of a diverse range of sizes and materials. Stresses and stress-induced deformations need to be managed carefully to yield correct device properties. The Maskless Aligner technology is ideally suited to make on the fly corrections to the design if required.

Structuring flexible substrates is challenging as the shape and the distortions vary with applied forces. Maskless lithography offers the unique option of exposing the substrates with warpage-dependent pre-distortions, to maximize yield.

Writing performance
Minimum lines and spaces [µm]	2
Minimum feature size [µm]	1.5
CD uniformity [3σ, nm]	200
Edge roughness [3σ, nm]	80
Stitching [3σ, nm]	120
2nd layer alignment [3σ, nm]	500
Backside alignment [3σ, nm]	1000
Exposure time per module (100 x 100 mm² at 80 mJ/cm² and 405 nm laser wavelength)	2.6 min
Maximum write speed with one module at 405 nm laser wavelength	5000 mm²/min

System features
Light source	High-power diode lasers at 375 nm or 405 nm
Maximum substrate size	300 x 300 mm²
Maximum exposure area	300 x 300 mm²
Substrate thickness	0.1 - 10 mm
Modular environmental chamber	Temperature stability ± 0.1°C
Real-time autofocus	Optical and/or pneumatic autofocus
Autofocus dynamic range	Up to 150 µm
Alignment	Advanced alignment; backside alignment optional
Automation	Automatic wafer handling and pre-alignment

System dimensions (excluding loader)
Height × width × depth	1980 mm x 1200 mm x 2310 mm
Weight	2600 kg

Installation requirements
Electrical	400 VAC, 50/60 Hz, 16 A

Please note
Specifications depend on individual process conditions and may vary according to equipment configuration. Write speed depends on pixel size and write mode. Design and specifications are subject to change without prior notice.

Download BROCHURE

MLA 300

Optimized for industrial manufacturing, ensuring high throughput and seamless production line integration

Direct-write Lithography

Flexibility

Time-saving

Exposure Quality

Dynamic Autofocus

Exposure Speed

Full Facility Integration

User-friendly

Automated Loading Module

Manufacturing Execution System (MES)

Backside Alignment

Exposure Wavelengths

Multipurpose Vacuum Chuck

Service Contracts

Direct-write Lithography

Flexibility

Time-saving

Exposure Quality

Dynamic Autofocus

Exposure Speed

Full Facility Integration

User-friendly

Automated Loading Module

Manufacturing Execution System (MES)

Backside Alignment

Exposure Wavelengths

Multipurpose Vacuum Chuck

Service Contracts

Customer applications

Technical Data

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