MLA 300

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Optimized for industrial manufacturing, ensuring high throughput and seamless production line integration

  • Product Description

  • The Maskless Aligner MLA 300 is designed for high-volume production, offering unmatched flexibility and precision in industrial lithography. Supporting wafers up to 300 x 300 mm, it dynamically adapts to surface variations, eliminating the need for costly and time-consuming mask production. By replacing traditional masks with direct data exposure, the MLA 300 enables innovative solutions for complex lithography challenges, such as advanced packaging, sensor calibration, and MEMS fabrication. Its high throughput, 1.5 μm resolution, simplified workflow, and seamless integration with manufacturing execution systems (MES) make it the ideal choice for diverse applications, including microfluidic devices and other advanced technologies.

    Key Features

    • High-Throughput Production: Optimized for industrial-scale production with a minimum feature size of 1.5 µm. For higher volume requirements, we also offer a high-throughput write mode with 3 µm minimum feature size.
    • Advanced Precision: This system offers the highest optical quality, ensuring precise and accurate patterning across a wide range of challenging substrates.
    • Full Automation: The MLA 300 features full automation, including customizable loading options, advanced software designed for production environments, and integration with MES systems.
    • Patented Substrate Tracking Technology: Real-time autofocus compensates for substrate warp or corrugations, guaranteeing flawless patterning and uniformity on all surfaces.

    Applications

    • Advanced Packaging: Capable of fan-out wafer-level packaging with compensation for die shift and chip height variations.
    • Sensors and Sensor ICs: Tailored for high-precision sensor manufacturing, ensuring accurate and customizable patterning.
    • MEMS and Microfluidic Devices: Ideal for the complex designs required in MEMS and microfluidic applications.
    • Discrete Electronic Components: Supports the production of various electronic components with high precision and adaptability.
    • Integrated Circuits and ASICs: Optimized for efficient production of both analog and digital ICs, as well as ASICs.
    • Probe Cards: Enables high-precision probe card production by ensuring accurate patterning and alignment for efficient testing and inspection.
    • Power Electronics: Optimized for substrates such as ceramics, overcoming warpage and thickness variations to deliver consistent quality.
    • OLED Displays: High precision and flexibility make the MLA 300 an excellent choice for OLED display manufacturing.

    Workflow and Cost Efficiency

    • Maskless Lithography overcomes limitations of mask-based systems, offering a flexible framework for per-die pattern corrections, serialization for quality control, or calibration tracing in sensor applications.
    • By eliminating the need for mask procurement, verification, and management, the MLA 300 streamlines the production process, reducing both time and complexity as designs are exposed directly from data.
    • The MLA 300 increases yield, particularly with challenging substrate applications, such as those affected by thermal processing, thanks to its advanced capabilities.
    • A real-time autofocus system compensates for substrate warping or corrugations, ensuring flawless patterning even on uneven surfaces.
    • Operating costs are minimized by the long-lifetime diode laser, estimated to last up to 10 years in 24/7 production, and the system’s minimal consumable requirements.
    • Modularity allows for quick maintenance, keeping downtime to a minimum.

    Contact us to learn more about the Maskless Aligner MLA 300 and how it can optimize your high-throughput microfabrication processes.

    The Maskless Aligner MLA 300 is designed for high-volume production, offering unmatched flexibility and precision in industrial lithography. Supporting wafers up to 300 x 300 mm, it dynamically adapts to surface variations, eliminating the need for costly and time-consuming mask production. By replacing traditional masks with direct data exposure, the MLA 300 enables innovative solutions for complex lithography challenges, such as advanced packaging, sensor calibration, and MEMS fabrication. Its high throughput, 1.5 μm resolution, simplified workflow, and seamless integration with manufacturing execution systems (MES) make it the ideal choice for diverse applications, including microfluidic devices and other advanced technologies.

    Key Features

    • High-Throughput Production: Optimized for industrial-scale production with a minimum feature size of 1.5 µm. For higher volume requirements, we also offer a high-throughput write mode with 3 µm minimum feature size.
    • Advanced Precision: This system offers the highest optical quality, ensuring precise and accurate patterning across a wide range of challenging substrates.
    • Full Automation: The MLA 300 features full automation, including customizable loading options, advanced software designed for production environments, and integration with MES systems.
    • Patented Substrate Tracking Technology: Real-time autofocus compensates for substrate warp or corrugations, guaranteeing flawless patterning and uniformity on all surfaces.

    Applications

    • Advanced Packaging: Capable of fan-out wafer-level packaging with compensation for die shift and chip height variations.
    • Sensors and Sensor ICs: Tailored for high-precision sensor manufacturing, ensuring accurate and customizable patterning.
    • MEMS and Microfluidic Devices: Ideal for the complex designs required in MEMS and microfluidic applications.
    • Discrete Electronic Components: Supports the production of various electronic components with high precision and adaptability.
    • Integrated Circuits and ASICs: Optimized for efficient production of both analog and digital ICs, as well as ASICs.
    • Probe Cards: Enables high-precision probe card production by ensuring accurate patterning and alignment for efficient testing and inspection.
    • Power Electronics: Optimized for substrates such as ceramics, overcoming warpage and thickness variations to deliver consistent quality.
    • OLED Displays: High precision and flexibility make the MLA 300 an excellent choice for OLED display manufacturing.

    Workflow and Cost Efficiency

    • Maskless Lithography overcomes limitations of mask-based systems, offering a flexible framework for per-die pattern corrections, serialization for quality control, or calibration tracing in sensor applications.
    • By eliminating the need for mask procurement, verification, and management, the MLA 300 streamlines the production process, reducing both time and complexity as designs are exposed directly from data.
    • The MLA 300 increases yield, particularly with challenging substrate applications, such as those affected by thermal processing, thanks to its advanced capabilities.
    • A real-time autofocus system compensates for substrate warping or corrugations, ensuring flawless patterning even on uneven surfaces.
    • Operating costs are minimized by the long-lifetime diode laser, estimated to last up to 10 years in 24/7 production, and the system’s minimal consumable requirements.
    • Modularity allows for quick maintenance, keeping downtime to a minimum.

    Contact us to learn more about the Maskless Aligner MLA 300 and how it can optimize your high-throughput microfabrication processes.

  • Product Highlights

  • Direct-write Lithography

    No mask-related costs, effort, or security risks

    Flexibility

    Direct writing in industrial production allows per-die pattern corrections, e.g. to react to distortions or process variations and serialization

    Time-saving

    Shorter time from prototyping to production. Digital design management replaces conventional mask library

    Exposure Quality

    Optical compensation of scaling, rotation; patented substrate tracking technology

    Dynamic Autofocus

    Superior critical dimensions (CD) uniformity on warped or corrugated substrates

    Exposure Speed

    300 x 300 mm2 in 5 minutes (write mode 3, two exposure modules)

    Full Facility Integration

    Customizable automatic loader, substrate chuck including warped substrates, custom workflow “wizards” and interface with manufacturing execution systems (MES)

    User-friendly

    SEMI-compliant user interface; customized workflow “wizards” for system operators

  • Available Modules

  • Automated Loading Module

    SEMI-standard BOLTS plane can be configured for open cassettes or Load Ports for FOUP. The number and configuration of ports can be selected and customized for round or rectangular substrates

    Manufacturing Execution System (MES)

    Integration Customizable workflow “wizards” to start exposure jobs, and integration to a central MES via SECS/GEM or OPC-UA protocols

    Backside Alignment

    Visual or through-wafer IR backside alignment available with 1 µm positioning accuracy

    Exposure Wavelengths

    High-power diode lasers with 7 W at 375 nm or 20 W at 405 nm with long lifetime are available

    Multipurpose Vacuum Chuck

    Customized vacuum chucks are available for applications with special substrates (e.g. warped panels)

    Service Contracts

    Service contract grades for faster on-site support and participation in the spare parts pool

The Maskless Aligner MLA 300 is designed for high-volume production, offering unmatched flexibility and precision in industrial lithography. Supporting wafers up to 300 x 300 mm, it dynamically adapts to surface variations, eliminating the need for costly and time-consuming mask production. By replacing traditional masks with direct data exposure, the MLA 300 enables innovative solutions for complex lithography challenges, such as advanced packaging, sensor calibration, and MEMS fabrication. Its high throughput, 1.5 μm resolution, simplified workflow, and seamless integration with manufacturing execution systems (MES) make it the ideal choice for diverse applications, including microfluidic devices and other advanced technologies.

Key Features

  • High-Throughput Production: Optimized for industrial-scale production with a minimum feature size of 1.5 µm. For higher volume requirements, we also offer a high-throughput write mode with 3 µm minimum feature size.
  • Advanced Precision: This system offers the highest optical quality, ensuring precise and accurate patterning across a wide range of challenging substrates.
  • Full Automation: The MLA 300 features full automation, including customizable loading options, advanced software designed for production environments, and integration with MES systems.
  • Patented Substrate Tracking Technology: Real-time autofocus compensates for substrate warp or corrugations, guaranteeing flawless patterning and uniformity on all surfaces.

Applications

  • Advanced Packaging: Capable of fan-out wafer-level packaging with compensation for die shift and chip height variations.
  • Sensors and Sensor ICs: Tailored for high-precision sensor manufacturing, ensuring accurate and customizable patterning.
  • MEMS and Microfluidic Devices: Ideal for the complex designs required in MEMS and microfluidic applications.
  • Discrete Electronic Components: Supports the production of various electronic components with high precision and adaptability.
  • Integrated Circuits and ASICs: Optimized for efficient production of both analog and digital ICs, as well as ASICs.
  • Probe Cards: Enables high-precision probe card production by ensuring accurate patterning and alignment for efficient testing and inspection.
  • Power Electronics: Optimized for substrates such as ceramics, overcoming warpage and thickness variations to deliver consistent quality.
  • OLED Displays: High precision and flexibility make the MLA 300 an excellent choice for OLED display manufacturing.

Workflow and Cost Efficiency

  • Maskless Lithography overcomes limitations of mask-based systems, offering a flexible framework for per-die pattern corrections, serialization for quality control, or calibration tracing in sensor applications.
  • By eliminating the need for mask procurement, verification, and management, the MLA 300 streamlines the production process, reducing both time and complexity as designs are exposed directly from data.
  • The MLA 300 increases yield, particularly with challenging substrate applications, such as those affected by thermal processing, thanks to its advanced capabilities.
  • A real-time autofocus system compensates for substrate warping or corrugations, ensuring flawless patterning even on uneven surfaces.
  • Operating costs are minimized by the long-lifetime diode laser, estimated to last up to 10 years in 24/7 production, and the system’s minimal consumable requirements.
  • Modularity allows for quick maintenance, keeping downtime to a minimum.

Contact us to learn more about the Maskless Aligner MLA 300 and how it can optimize your high-throughput microfabrication processes.

The Maskless Aligner MLA 300 is designed for high-volume production, offering unmatched flexibility and precision in industrial lithography. Supporting wafers up to 300 x 300 mm, it dynamically adapts to surface variations, eliminating the need for costly and time-consuming mask production. By replacing traditional masks with direct data exposure, the MLA 300 enables innovative solutions for complex lithography challenges, such as advanced packaging, sensor calibration, and MEMS fabrication. Its high throughput, 1.5 μm resolution, simplified workflow, and seamless integration with manufacturing execution systems (MES) make it the ideal choice for diverse applications, including microfluidic devices and other advanced technologies.

Key Features

  • High-Throughput Production: Optimized for industrial-scale production with a minimum feature size of 1.5 µm. For higher volume requirements, we also offer a high-throughput write mode with 3 µm minimum feature size.
  • Advanced Precision: This system offers the highest optical quality, ensuring precise and accurate patterning across a wide range of challenging substrates.
  • Full Automation: The MLA 300 features full automation, including customizable loading options, advanced software designed for production environments, and integration with MES systems.
  • Patented Substrate Tracking Technology: Real-time autofocus compensates for substrate warp or corrugations, guaranteeing flawless patterning and uniformity on all surfaces.

Applications

  • Advanced Packaging: Capable of fan-out wafer-level packaging with compensation for die shift and chip height variations.
  • Sensors and Sensor ICs: Tailored for high-precision sensor manufacturing, ensuring accurate and customizable patterning.
  • MEMS and Microfluidic Devices: Ideal for the complex designs required in MEMS and microfluidic applications.
  • Discrete Electronic Components: Supports the production of various electronic components with high precision and adaptability.
  • Integrated Circuits and ASICs: Optimized for efficient production of both analog and digital ICs, as well as ASICs.
  • Probe Cards: Enables high-precision probe card production by ensuring accurate patterning and alignment for efficient testing and inspection.
  • Power Electronics: Optimized for substrates such as ceramics, overcoming warpage and thickness variations to deliver consistent quality.
  • OLED Displays: High precision and flexibility make the MLA 300 an excellent choice for OLED display manufacturing.

Workflow and Cost Efficiency

  • Maskless Lithography overcomes limitations of mask-based systems, offering a flexible framework for per-die pattern corrections, serialization for quality control, or calibration tracing in sensor applications.
  • By eliminating the need for mask procurement, verification, and management, the MLA 300 streamlines the production process, reducing both time and complexity as designs are exposed directly from data.
  • The MLA 300 increases yield, particularly with challenging substrate applications, such as those affected by thermal processing, thanks to its advanced capabilities.
  • A real-time autofocus system compensates for substrate warping or corrugations, ensuring flawless patterning even on uneven surfaces.
  • Operating costs are minimized by the long-lifetime diode laser, estimated to last up to 10 years in 24/7 production, and the system’s minimal consumable requirements.
  • Modularity allows for quick maintenance, keeping downtime to a minimum.

Contact us to learn more about the Maskless Aligner MLA 300 and how it can optimize your high-throughput microfabrication processes.

Direct-write Lithography

No mask-related costs, effort, or security risks

Flexibility

Direct writing in industrial production allows per-die pattern corrections, e.g. to react to distortions or process variations and serialization

Time-saving

Shorter time from prototyping to production. Digital design management replaces conventional mask library

Exposure Quality

Optical compensation of scaling, rotation; patented substrate tracking technology

Dynamic Autofocus

Superior critical dimensions (CD) uniformity on warped or corrugated substrates

Exposure Speed

300 x 300 mm2 in 5 minutes (write mode 3, two exposure modules)

Full Facility Integration

Customizable automatic loader, substrate chuck including warped substrates, custom workflow “wizards” and interface with manufacturing execution systems (MES)

User-friendly

SEMI-compliant user interface; customized workflow “wizards” for system operators

Automated Loading Module

SEMI-standard BOLTS plane can be configured for open cassettes or Load Ports for FOUP. The number and configuration of ports can be selected and customized for round or rectangular substrates

Manufacturing Execution System (MES)

Integration Customizable workflow “wizards” to start exposure jobs, and integration to a central MES via SECS/GEM or OPC-UA protocols

Backside Alignment

Visual or through-wafer IR backside alignment available with 1 µm positioning accuracy

Exposure Wavelengths

High-power diode lasers with 7 W at 375 nm or 20 W at 405 nm with long lifetime are available

Multipurpose Vacuum Chuck

Customized vacuum chucks are available for applications with special substrates (e.g. warped panels)

Service Contracts

Service contract grades for faster on-site support and participation in the spare parts pool

Customer applications

Advanced Packaging: Heidelberg Instruments‘ MLA 300 enables higher interconnect densities by exposing tailored designs matching the exact position of each die
Heidelberg Instruments‘ MLA 300 enables higher interconnect densities by exposing tailored designs matching the exact position of each die.
MLA300 Exposures
Resolution pattern exposed in a 500 nm layer of AZ1500 showing a minimum feature size of 1.5 µm. (SEM image, viewed with a 45° angle)
MLA300 Exposures
Test structures exposed in a 10 µm layer of AZ 10XT. (SEM image, viewed with a 45° angle)
MLA300 Exposures
Resolution pattern exposed in a 10 µm layer of AZ 10XT showing an aspect ratio of 1:5. (SEM image, viewed with a 45° angle)
MLA300 Exposures
Optical microscope view of a micro QR code exposed in AZ1500 (500 nm) resist.
MEMS processes integrate standard microchip technologies with electromechanical components of a diverse range of sizes and materials. Stresses and stress-induced deformations need to be managed carefully to yield correct device properties. The Maskless Aligner technology is ideally suited to make on the fly corrections to the design, if required.
MEMS processes integrate standard microchip technologies with electromechanical components of a diverse range of sizes and materials. Stresses and stress-induced deformations need to be managed carefully to yield correct device properties. The Maskless Aligner technology is ideally suited to make on the fly corrections to the design, if required.
Structuring flexible substrates is challenging as the shape and the distortions vary with applied forces. Maskless lithography offers the unique option of exposing the substrates with warpage-dependent pre-distortions, to maximize yield.
Structuring flexible substrates is challenging as the shape and the distortions vary with applied forces. Maskless lithography offers the unique option of exposing the substrates with warpage-dependent pre-distortions, to maximize yield.

Why customers choose our systems

“The MLA 300 is a perfect tool for our R&D facility. Without having to make masks the cycle time for design iterations has step changed from days to minutes. The quick turnaround and versatility has made the MLA the preferred exposure tool for ourselves and internal customers rendering our other projection and contact aligners redundant.”

John McLean, Principle Process Development Engineer
Centre for Process Innovation (CPI)
Sedgefield, England

Technical Data

Writing performanceWrite Mode IIWrite Mode III
Minimum lines and spaces [µm]23
Minimum feature size [µm]1.53
CD uniformity [3σ, nm]200300
Edge roughness [3σ, nm]80100
2nd layer alignment [3σ, nm]500700
Backside alignment [3σ, nm]10001000
Exposure time (80 mJ/cm² and 405 nm laser) for 100 x 100 mm²2.75 min (one exposure module installed)1.5 min (one exposure module installed)
Exposure time (80 mJ/cm² and 405 nm laser) for 200 x 200 mm²9 min (one exposure module installed)
4.7 min (two exposure modules installed)		4.6 min (one exposure module installed)
2.5 min (two exposure modules installed)
Exposure time (80 mJ/cm² and 405 nm laser) for 300 x 300 mm²19.5 min (one exposure module installed)
10 min (two exposure modules installed)		9.6 min (one exposure module installed)
5 min (two exposure modules installed)
Maximum write speed (405 nm laser) [mm²/min]4615 (one exposure module installed)
9000 (two exposure modules installed)		9375 (one exposure module installed)
18000 (two exposure modules installed)
System features
Light sourceHigh-power diode laser with long life-time at 375 nm and/or 405 nm
Maximum substrate size300 x 300 mm²
Maximum exposure area300 x 300 mm²
Substrate thickness0.1 - 10 mm
Internal temperature stability± 0.1°C
Real-time autofocusOptical and pneumatic autofocus
Autofocus dynamic rangeUp to 150 µm
AlignmentAdvanced alignment; backside alignment optional
AutomationAutomatic wafer handling and pre-alignment
System dimensions (excluding loader)
Height × width × depth1980 mm x 1200 mm x 2310 mm
Weight2600 kg
Installation requirements
Electrical400 VAC, 50/60 Hz, 16 A
Compressed air7 - 10 bar

Please note
Specifications depend on individual process conditions and may vary according to equipment configuration. Write speed depends on pixel size and write mode. Design and specifications are subject to change without prior notice.

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Disclaimer: Translations were created with the help of AI. Heidelberg Instruments does not guarantee the completeness and correctness of the translations.

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