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Home Waferbond’22

Date

Oct 05 - 06 2022

Expired!

Time

all day

Waferbond’22

The International Conference on Wafer Bonding – WaferBond’22. Heidelberg Instruments is Silver Sponsor of this event.

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1D & 2D Materials
Advanced Packaging
Biotechnology and Medical Engineering
Displays
High-Security Printing
Materials Science
MEMS
Microfluidics and Nanofluidics
Micro-optics and Photonics
Microelectronics and Nanoelectronics
Nanoimprint Templates
Photomasks
Quantum Devices
Semiconductors
Sensors

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Maskless Laser Lithography
3D Lithography by TPP
Thermal Scanning Probe Lithography

Maskless Laser Lithography
3D Lithography by TPP
Thermal Scanning Probe Lithography

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Small & Unconventional Substrates

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Grayscale Lithography
High Aspect Ratio
High & Ultra-High Resolution
In-situ Inspection & Metrology
Non-invasive Nanolithography
Small & Unconventional Substrates

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μMLA
MLA 150
DWL 66⁺
MPO 100
NanoFrazor Scholar
NanoFrazor Explore
MLA 300
DWL 2000 GS / DWL 4000 GS
VPG⁺ 200 / VPG⁺ 400
VPG⁺ 800 / VPG⁺ 1400
VPG 300 DI
ULTRA
Contact Sales

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