Flexible Small Batch Production

MEMS (Micro-Electro-Mechanical Systems) are devices that consist of micro system components with dimensions in a range of 1 µm to 100 µm. MEMS facilitate the miniaturization of existing devices, provide new functionality using physical principles that do not work at larger scale, and enable development of tools to operate in the micro-world. MEMS may present as complex machines such as sensors or actuators, or as simple structures like cantilevers, gearwheels or other mechanical parts.
Well-known examples are accelerometers, gyroscopes, pressure sensors, biosensors, micro pumps, micro valves etc. A subsection of MEMS are MOEMS (Micro-Optical-Electrical-Mechanical-Systems) devices, which combine MEMS with Micro-Optics: for example optical switches, optical modulators, or optical interconnects.
The fabrication of MEMS is based on semiconductor process technology, consisting of deposition of material layers, patterning by photolithography, and etching to produce the required shapes.
Bulk Micromachining is a technology where the whole thickness of the silicon is used to build microstructures by applying various etching processes. For all fabrication methods, be it bulk or surface micromachining, lithography is required to create etch mask on silicon or high-aspect ratio structures in thick photoresists. Here, our Direct Write Lithography is the ideal technology to accomplish rapid prototyping of MEMS devices.

Rapid prototyping

Combined structure types and dimensions

Throughput regardless of complexity

High throughput

Up to 5000 mm²/min

Grayscale lithography

Create 2.5D topography, e.g. tapered channels

High aspect ratio

High structures up to 1mm high

No undercut

The structure can be used for replication

Application images


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