VPG+ 800 / VPG+1400

Designed for photomask production on large substrates in display applications

These large-area VPG+ tools are tailored for high-throughput patterning of large-area wafers (from 0.8 to 1.4 m). VPG+ 1400 is our largest system specifically designed for the display industry. It is optimal for flat panel display (FPD) applications such as TFT-arrays, color filters and ITO. These tools are also used for industrial large-area photomask applications for advanced packaging, semiconductors, LEDs, and touch panel applications.

The VPG+ series is designed for high-quality and fast exposures with extremely accurate alignment. It features a differential interferometer with a resolution down to 1.2 nm. Mura optimization ensures excellent CD uniformity and resolution. The closed-loop environmental chambers comply with the most stringent requirements for advanced photomasks fabrication. Stabilization of writing conditions ensures mask-to-mask reproducibility and compensates for any variations during long exposures. VPG+ systems support all industrial data formats.

Exposure Quality

Edge roughness 40 nm; CD uniformity 65 nm; address grid down to 12.5 nm; Mura correction, edge detection

Writing Stability

Integrated metrology system with flowbox and software correction compensates for any variations in environmental parameters

Automated Alignment

Automated global and field-by-field alignment with distortion correction. Sophisticated 2D correction matrix for stage position calibration

Overall Cost of Ownership

Laser ca. 25.270 EUR/year at 0.2 EUR/kWh, 90% tool operation; Other consumables 38.500 EUR/year


VPG+ platforms scale easily for all sizes from <4" to G8 masks 1200 mm x 1400 mm

Exposure Speed

800 mm x 800 mm in 82 minutes; 1400 mm x 1400 mm in 238 minutes

Variable Stage Dimensions

Accomodate large substrates: 800 mm / 1400 mm


Semi- or fully automated substrate loading; write-mode exchanger unit; Mura and panel pitch optimization


Special substrates, loader, mask handling, on request

Customer applications

Technical Data

Write modeIIIIII
Writing performance
Minimum structure size [μm]0.7512
Address grid [nm]12.52550
Edge roughness [3σ, nm]405070
CD uniformity [3σ, nm]6580110
Stitching [3σ, nm]6070100
Registration [3σ, nm]200200200
Write speed [mm²/min]112541258250
System features
Light sourceHigh power DPSS laser with 355 nm
Maximum substrate sizes32″ x 32″ / 1400 x 1400 mm²
Substrate thickness0 to 12 mm / 0 to 12 mm / 2 to 13.2 mm
Maximum exposure area800 x 800 mm² / 1400 x 1400 mm²
AutofocusRealtime autofocus system
Autofocus compensation range80 µm
AutomationAutomatic substrate loading system
FlowboxClosed-loop temperature controlled environmental chamber
Alignment Camera system for metrology and alignment
Other featuresStage map correction, Mura correction, Edge detector system, Multiple data input formats (DXF, CIF, GDSII and Gerber files)
System dimensions
Main unit (doors closed, loader extended)VPG+ 800 / VPG+ 1400
Width [mm]3100 / 5370
Depth [mm]4250 / 7000
Height [mm]2700 / 2800
Weight [kg]10,000 / 25,000
Installation requirements
Electrical400 VAC ± 5 %, 50/60 Hz, 32 A
Compressed air8 - 10 bar

Please note
Specifications depend on individual process conditions and may vary according to equipment configuration. Write speed depends on pixel size and write mode. Design and specifications are subject to change without prior notice

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