Configurable and compact tabletop maskless aligner with raster scan and vector exposure modules

The table-top µMLA system is state-of-the-art in maskless technology built on the renowned µPG platform – the most sold tabletop maskless system worldwide. It is a perfect entry-level research and development (R&D) tool for virtually any application requiring microstructures. Typical examples are microfluidics (cell sorting devices, lab-on-a-chip), small-scale mask-writing, micro-optic and microlens arrays, sensors, MEMS, contacting 2D materials and fanning out electrodes, etc.

µMLA is flexible and customizable. Users can choose between types of exposure modules. The Raster Module is used for fast exposure independent of design complexity. The Vector Module is designed for patterning continuous smooth curves such as waveguides in a faster and more accurate way. Three optical setups offer a choice of variable resolution and throughput. Each allows easy switching between different resolution and speed configurations to optimize exposure for a given application. Draw Mode enables straightforward ad-hoc modifications to existing structures and electrical contacts to nanowires or 2D materials. With its small footprint, µMLA fits on a regular table.

Direct-write Lithography

No mask-related costs, effort, or security risks

Exposure Quality

Edge roughness raster mode 100 nm; vector mode 30 nm; CD uniformity 200 nm

Exposure Speed

4” wafer in 90 minutes

Small Footprint

63x80x53 cm / 25”x32”x21” – the smallest tabletop maskless lithography too

Flexible Configuration

Choice of exposure wavelength; a choice of raster and vector scan modules

Flexible Use

Software enables easy switching for variable resolution and throughput speeds


Intuitive software and tool operation, easy handling of small samples

Plug-and-play Setup

Raster Scan Exposure Mode

Fast with excellent image quality and fidelity, write time is independent of structure size or pattern density. LED light source at 365 or 390 nm

Vector Scan Exposure Mode

Patterning continuous structures consisting of curved lines – where smooth contours are required. Laser light source 405 nm and/or 375 nm

3 Optical Setups

Min. resolution of 0.6 µm, 1 µm and 3 µm; variable resolution within each mode

Optional Overview Camera

Fast and easy location of alignment marks or other features of interest on substrate

Glovebox Integration

MBraun glovebox for patterning of sensitive materials in a controlled Nitrogen environment

Draw Mode

Import and overlay of .bmp files on top of the real-time microscope image — as in a virtual mask aligner; simple lines and shapes can be drawn into the real-time camera image for immediate exposure

Optical Autofocus

Perfect exposure of small samples (less than 10 mm)

Exposure Area

Can be upgraded from 100 x 100 mm to 150 x 150 mm

Choice of Exposure, Wavelength and Source

Raster Scan Mode: LED light source at 365 or 390 nm. Vector Scan Mode: laser light source 405 nm and/or 375 nm

Customer applications

Technical Data

Write Mode I*Write Mode II*Write Mode III*
Writing performance (Raster Scan Exposure Module)
Minimum structure size [μm]0.613
Minimum lines and spaces [μm]0.81.53
Address grid [nm]2050100
CD uniformity [3σ, nm]200300400
2nd layer alignment over 5 x 5 mm² [nm]5005001000
2nd layer alignment over 50 x 50 mm² [nm]100010002000
Write speedwith 390 nm LED / 365 nm LEDwith 390 nm LED / 365 nm LEDwith 365 nm LED
Write speed10 mm²/min at 0.6 µm40 mm²/min at 1 µm100 mm²/min at 3 µm
Optional write speeds at different minimum structure sizes with “Variable Resolution for Raster Scan Exposure Module”18 mm²/min at 1 µm60 mm²/min at 2 µm120 mm²/min at 4 µm
25 mm²/min at 2 µm90 mm²/min at 4 µm240 mm²/min at 6 µm
Writing performance (Vector Exposure Module)
Minimum feature size [µm]0.613
Address grid [nm]202020
2nd layer alignment over 5 x 5 mm² [nm]5005001000
2nd layer alignment over 50 x 50 mm² [nm]100010002000
Maximum linear write speed in Vector Mode200 mm/s
Available spot sizes in Vector Mode [µm]0.6 / 1 / 2 / 5 / 101 / 2 / 5 / 10 / 253 / 5 / 10 / 25 /50
System specifications
Maximum substrate size6″ x 6″
Minimum substrate size5 mm x 5 mm
Substrate thickness0.1 to 12 mm
Maximum write area150 mm x 150 mm
Raster scan exposure moduleVector exposure module
Light sourceLED; 390 nm or 365 nmLaser; 405 nm and/or 375 nm
System dimensions (lithography unit)
µMLAWidth x DepthHeight x Weight
Main system housing640 mm (25″) x 840 mm (33″)530 mm (21″) x 130 kg (285 lbs)
Installation requirements
Electrical230 VAC / 6A or 110 VAC / 12A (± 5%, 50/60 Hz)
Compressed air6 - 10 bar, stability ± 0.5 bar
CleanroomISO 6 recommended
Temperature stability±1°C
* Only one write mode can be installed on the system

Please note
Specifications depend on individual process conditions and may vary according to equipment configuration. Write speed depends on pixel size and write mode. Design and specifications are subject to change without prior notice

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