Configurable and compact tabletop maskless aligner with raster scan and vector exposure modules
Customer applications
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“Heidelberg’s µMLA succeeds in patterning quickly and accurately at the micrometer scale. Its DMD technology is not only precise in terms of writing quality and realignment, but it is also much faster than previous technologies. The optical focus is a decisive advantage for small samples. The very simple and intuitive software interface is also very much appreciated by users and trainers of the equipment, as new users can become autonomous in less than an hour on crucial steps of circuit prototyping.”
Technical Data
| Write Mode I * | Write Mode II * | Write Mode III * | |
|---|---|---|---|
| Writing performance (Raster Scan Exposure Module) | |||
| Minimum structure size [μm] | 0.6 | 1 | 3 |
| Minimum lines and spaces [μm] | 0.8 | 1.5 | 3 |
| Address grid [nm] | 20 | 50 | 100 |
| CD uniformity [3σ, nm] | 200 | 300 | 400 |
| 2nd layer alignment over 5 x 5 mm² [nm] | 500 | 500 | 1000 |
| 2nd layer alignment over 50 x 50 mm² [nm] | 1000 | 1000 | 2000 |
| Write speed | with 390 nm LED / 365 nm LED | with 390 nm LED / 365 nm LED | with 365 nm LED |
| Write speed | 10 mm²/min at 0.6 µm | 40 mm²/min at 1 µm | 100 mm²/min at 3 µm |
| Optional write speeds at different minimum structure sizes with “Variable Resolution for Raster Scan Exposure Module” | 18 mm²/min at 1 µm | 60 mm²/min at 2 µm | 120 mm²/min at 4 µm |
| 25 mm²/min at 2 µm | 90 mm²/min at 4 µm | 240 mm²/min at 6 µm | |
| Writing performance (Vector Mode Exposure Module) | |||
| Minimum feature size [µm] | 0.6 | 1 | 3 |
| Address grid [nm] | 20 | 20 | 20 |
| 2nd layer alignment over 5 x 5 mm² [nm] | 500 | 500 | 1000 |
| 2nd layer alignment over 50 x 50 mm² [nm] | 1000 | 1000 | 2000 |
| Maximum linear write speed in Vector Mode | 200 mm/s | 200 mm/s | 200 mm/s |
| Available spot sizes in Vector Mode [µm] | 0.6 / 1 / 2 / 5 / 10 | 1 / 2 / 5 / 10 / 25 | 3 / 5 / 10 / 25 /50 |
| System specifications | |||
| Maximum substrate size | 6″ x 6″ | ||
| Minimum substrate size | 5 x 5 mm2 | ||
| Substrate thickness | 0.1 to 12 mm | ||
| Maximum write area | 150 x 150 mm2 |
| Raster scan exposure module | Vector exposure module | |
|---|---|---|
| Light source | LED; 390 nm or 365 nm | Laser; 405 nm and/or 375 nm |
| System dimensions (lithography unit) | ||
| µMLA | Width x Depth | Height x Weight |
| Main system housing | 640 mm (25") x 840 mm (33") | 530 mm (21") x 130 kg (285 lbs) |
| Installation requirements | ||
| Electrical | 230 VAC / 6A or 110 VAC / 12A (±5%, 50/60 Hz) | |
| Compressed air | 6 - 10 bar | |
| Cleanroom | ISO 6 recommended | |
| Temperature stability | ±1 °C | |
| * Only one write mode can be installed on the system |