Configurable and compact tabletop maskless aligner with raster scan and vector exposure modules
The table-top µMLA system is state-of-the-art in maskless technology built on the renowned µPG platform – the most sold tabletop maskless system worldwide. It is a perfect entry-level research and development (R&D) tool for virtually any application requiring microstructures. Typical examples are microfluidics (cell sorting devices, lab-on-a-chip), small-scale mask-writing, micro-optic and microlens arrays, sensors, MEMS, contacting 2D materials and fanning out electrodes, etc.
µMLA is flexible and customizable. Users can choose between types of exposure modules. The Raster Module is used for fast exposure independent of design complexity. The Vector Module is designed for patterning continuous smooth curves such as waveguides in a faster and more accurate way. Three optical setups offer a choice of variable resolution and throughput. Each allows easy switching between different resolution and speed configurations to optimize exposure for a given application. Draw Mode enables straightforward ad-hoc modifications to existing structures and electrical contacts to nanowires or 2D materials. With its small footprint, µMLA fits on a regular table.
Direct-write Lithography
Exposure Quality
Exposure Speed
Small Footprint
Flexible Configuration
Flexible Use
User-friendly
Plug-and-play Setup
Raster Scan Exposure Mode
Vector Scan Exposure Mode
3 Optical Setups
Optional Overview Camera
Glovebox Integration
Draw Mode
Optical Autofocus
Exposure Area
Choice of Exposure, Wavelength and Source
Customer applications
Technical Data
Write Mode I* | Write Mode II* | Write Mode III* | |
---|---|---|---|
Writing performance (both Raster Scan and Vector Exposure Module) | |||
Minimum structure size [μm] | 0.6 | 1 | 3 |
Minimum lines and spaces [half pitch, μm] | 0.8 | 1.5 | 3 |
2nd layer alignment over 5 x 5 mm² [3σ, nm] | 500 | 500 | 1000 |
2nd layer alignment over 50 x 50 mm² [3σ, nm] | 1000 | 1000 | 2000 |
Writing performance with the Raster Scan Exposure Module | |||
CD uniformity [3σ, nm] | 200 | 300 | 400 |
Max. write speed [mm²/min] | 10 | 30 | 130 |
10 mm²/min at 0.6 µm | 30 mm²/min at 1 µm | 130 mm²/min** at 3 µm | |
Write speed with optional “Variable Resolution for Raster Scan Exposure Module” (UMVAR) for different minimum structure sizes | 20 mm²/min at 1 µm | 60 mm²/min at 2 µm | 160 mm²/min** at 4 µm |
25 mm²/min at 2 µm | 90 mm²/min at 4 µm | 300 mm²/min** at 6 µm | |
Writing performance with the Vector Exposure Module | |||
Address grid in vector mode [nm] | 20 | ||
Edge roughness [3σ, nm] | 30 | 50 | 100 |
Maximum linear write speed | 200 mm/s | ||
System specifications | |||
Maximum substrate size | 6″ x 6″ | ||
Minimum substrate size | 5 mm x 5 mm | ||
Substrate thickness | 0.1 to 12 mm | ||
Maximum write area | 150 mm x 150 mm |
Raster scan exposure module | Vector exposure module | |
---|---|---|
Light source | LED; 390 nm or 365 nm | Laser; 405 nm and/or 375 nm |
System dimensions (lithography unit) | ||
µMLA | Width x Depth | Height x Weight |
Main system housing | 630 mm (25″) x 800 mm (31.5″) | 530 mm (21″) x 100 kg (220 lbs) |
Optional antivibrational table plus user PC table | 1400 mm (55″) x 700 mm (28″) | 750 mm (30″) x 350 kg (770 lbs) |
Installation requirements | ||
Electrical | 230 VAC ± 5%, 50/60 Hz, 16A | |
Compressed air | 6 - 10 bar, stability ± 0.5 bar | |
* Only one write mode can be installed on the system | ||
** With standard 390 nm LED |
Please note
Specifications depend on individual process conditions and may vary according to equipment configuration. Write speed depends on pixel size and write mode. Design and specifications are subject to change without prior notice