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MLA 300 successfully installed at Japanese photolithography process service provider

Recognition of the exceptional performance: The successful installation of our MLA 300 Maskless Aligner at a Japanese photolithography service provider is underscoring the systems unparalleled capabilities in direct writing on 300 mm wafers and precision in photomask production. The company offers processing services that combine photolithography technique as a core technology with surrounding technologies. Such precision-processed products are used by a wide range of customers as important parts. 

With the MLA 300 Maskless Aligner, lithography is no longer reliant on fixed masks but on digital designs that can be exposed while dynamically adapting to surface and process variations from previous fabrication steps, delivering enhanced flexibility, unparalleled quality, cost savings, and control over the manufacturing process for our customer. 

Discover how the MLA 300 is fostering innovation and driving industry forward, excelling in applications ranging from sensors, sensor ICs, MEMS devices, discrete electronic components, analog and digital ICs, ASICs, power electronics, OLED displays, to semiconductor packaging applications.

The Heidelberg Instruments systems and technology pool comprises high-precision Maskless Aligner (MLA) and Laser Lithography systems for Direct Writing of 2D, 2.5D and 3D microstructures to mask-making, and systems based on Thermal Scanning Probe Lithography (t-SPL) for the advanced nanopatterning. 3D laser lithography systems based on Two-Photon Polymerization (TPP) technology close the gap between conventional laser lithography – the basis of Heidelberg Instruments’ strong core business – and the Thermal Scanning Probe Lithography (t-SPL) for nanopatterning.

Maskless Lithography is a state-of-the-art, high-precision, highly flexible technology, ideal for use in both R&D as well as environments where rapid-prototyping of feature sizes greater than 1 µm are required. This technique enables you to transfer a design directly to the wafer without the need for a photomask. The pattern is exposed directly onto the substrate surface with the help of a spatial light modulator, or SLM, which serves as a “dynamic photomask”.

Explore the Maskless Laser Lithography core technology:

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