Heidelberg, Germany – Heidelberg Instruments has made significant performance upgrades to its renowned DWL 66⁺ direct-write lithography system, solidifying its position as the ultimate research tool for microfabrication. The system now delivers a market-leading minimum feature size of 200 nm and advanced grayscale capabilities with 65,536 levels, empowering researchers to push the boundaries of innovation in different dimensions.

The new High-Resolution Mode, Write Mode XR, achieves an unsurpassed combination of resolution, quality, and speed. Its 200 nm minimum feature capability allows for the fabrication of highly complex micro- and nanostructures, enabling applications in quantum devices, optics, and photonics that previously required more time-consuming e-beam lithography. This advancement accelerates development cycles and frees up cost-intensive e-beam systems for their most demanding tasks.

Complementing the high resolution is the system’s professional-grade grayscale lithography. With an unprecedented 65,536 intensity levels, the DWL 66⁺ can create intricate 2.5D microstructures, such as micro-lenses and other micro-optical devices, with outstanding surface smoothness in photoresists up to 150 µm thick.

With 30 years of continuous development and over 400 units installed, the DWL 66⁺ is a proven, robust, and extremely flexible platform for R&D and rapid prototyping. These latest enhancements reinforce its value, offering users a powerful combination of extreme resolution and operational flexibility.

For more information on the DWL 66⁺ lithography system, please visit: https://heidelberg-instruments.com/product/dwl-66-laser-lithography-system/