Two-dimensional material-property gradients in magnetic thin films unlock novel behaviors, enabling devices such as spin-wave filters and passive domain-wall reset architectures, expanding functionality for future
Engineered nanotopography induces tensile strain in MoS2 FETs, significantly enhancing carrier mobility and on-state current, promising advancements for 2D material-based electronics.
A novel method for fabricating a hybrid device that integrates light-triggered proton pumps into a network of nanochannels for applications in directed ion transport.
This review discusses and compares different lithographic techniques for fabricating SERS substrates, highlighting their strengths and limitations, and explores their potential for commercial applications.
This paper examines the use of thermal nanoconversion (TNC) to modify the magnetic properties of nickel-iron (Ni80Fe20) nanoislands.
A novel method for amplifying the depth of grayscale nanopatterns in dielectric materials like SiO2 using a combination of t-SPL and optimized dry etching techniques.
This paper describes the fabrication and characterisation of a flat conical lens (fraxicon) with a diameter of 0.2 mm for use in miniaturised optical applications.
This paper describes a scalable and CMOS-compatible fabrication strategy for modifying individual field-effect transistors (FETs) with distinct bioreceptors.
Low-dimensional semiconductors, like tellurium nanoribbons, enable miniaturized logic devices via ambipolar conduction. Non-invasive lithography creates transistors performing all seven basic logic operations.
Thermal scanning probe lithography enables fast fabrication of micro/nano structures with 100nm resolution, enhancing electronic performance through gold coating and resistivity characterization.
As AI and HPC push monolithic circuits to obsolescence, the industry turns to Advanced Packaging. Yet, challenges like die shift and substrate warpage threaten to kill yield before the package leaves the fab. Enter the new hero of microelectronics: Maskless Lithography. Learn how adaptive alignment ensures your chiplets live to compute another day.
What a week! From September 15–18, we had the pleasure of joining the micro- and nanofabrication community at the 51st International Micro and Nano Engineering Conference (MNE 2025) in Southampton, UK.
Heidelberg Instruments proudly celebrates the 10th anniversary of the MLA 150 Maskless Aligner—a breakthrough that has redefined high-resolution lithography in cleanrooms around the world.
Heidelberg Instruments Korea celebrates 20 years of customer commitment and partnership! Built on trust, loyalty, and long-term relationships, Heidelberg Instruments Korea continues to play a vital role in bringing innovation to local customers.
Join Heidelberg Instruments in Southampton for MNE 2025! We are proud to be sponsor of the prestigious Fellow Award and are looking forward to celebrate the 10th anniversary of our MLA 150 with you.
Heidelberg Instruments has made significant performance upgrades to its renowned DWL 66⁺, solidifying its position as the ultimate research tool for microfabrication.
The DWL 66+ is now more powerful than ever, featuring two game-changing enhancements that redefine what’s possible with optical lithography.
Direct Laser Writing accelerates the fabrication of custom infrared metasurfaces—enabling fast, flexible, and cost-effective beam shaping, holography, and more, without complex lithography.
Physicists have crafted the “world’s smallest violin” as a stunning demonstration of their new NanoFrazor nanolithography capabilities.
Read Heidelberg Instruments’ recap of the OPTICA Global Advanced Manufacturing Alliance Meeting 2025. Thanks to all for advancing photonics innovation!
Follow us on social media to benefit
from a range of useful resources.
Disclaimer: Translations were created with the help of AI. Heidelberg Instruments does not guarantee the completeness and correctness of the translations.
