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Home EPTC 2022

Date

Dec 07 - 09 2022

Expired!

Time

all day

EPTC 2022

24^th Electronics Packaging Technology Conference.
Heidelberg Instruments will be represented by Regional Business Network (RBN).

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APPLICATIONS

1D & 2D Materials
Advanced Packaging
Biotechnology and Medical Engineering
Displays
High-Security Printing
Materials Science
MEMS
Microfluidics and Nanofluidics
Micro-optics and Photonics
Microelectronics and Nanoelectronics
Nanoimprint Templates
Photomasks
Quantum Devices
Semiconductors
Sensors

1D & 2D Materials
Advanced Packaging
Biotechnology and Medical Engineering
Displays
High-Security Printing
Materials Science
MEMS
Microfluidics and Nanofluidics
Micro-optics and Photonics
Microelectronics and Nanoelectronics
Nanoimprint Templates
Photomasks
Quantum Devices
Semiconductors
Sensors

CORE TECHNOLOGIES

Maskless Laser Lithography
3D Lithography by TPP
Thermal Scanning Probe Lithography

Maskless Laser Lithography
3D Lithography by TPP
Thermal Scanning Probe Lithography

KEY FEATURES

Accurate Pattern Placement
Grayscale Lithography
High Aspect Ratio
High & Ultra-High Resolution
In-situ Inspection & Metrology
Non-invasive Nanolithography
Small & Unconventional Substrates

Accurate Pattern Placement
Grayscale Lithography
High Aspect Ratio
High & Ultra-High Resolution
In-situ Inspection & Metrology
Non-invasive Nanolithography
Small & Unconventional Substrates

PRODUCTS

μMLA
MLA 150
DWL 66⁺
MPO 100
NanoFrazor Scholar
NanoFrazor Explore
MLA 300
DWL 2000 GS / DWL 4000 GS
VPG⁺ 200 / VPG⁺ 400
VPG⁺ 800 / VPG⁺ 1400
VPG 300 DI
ULTRA
Contact Sales

μMLA
MLA 150
DWL 66⁺
MPO 100
NanoFrazor Scholar
NanoFrazor Explore
MLA 300
DWL 2000 GS / DWL 4000 GS
VPG⁺ 200 / VPG⁺ 400
VPG⁺ 800 / VPG⁺ 1400
VPG 300 DI
ULTRA
Contact Sales

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