ULTRA

The Semiconductor Laser Mask Writer

The ULTRA specifically addresses the production of mature semiconductor photomasks. It provides an economical mask writer solution with all the features you require for high throughput, high precision and structure uniformity, and extremely accurate alignment. With its modern, compact build, you can easily incorporate the system into an existing mask shop infrastructure.

Mature photomasks continue to be a vital component in semiconductor device fabrication, being used in power management, microcontrollers, LED lighting, the IOT, MEMS, the automotive industry, to name but a few. The ULTRA serves this market with structure sizes down to 500 nm and write speeds up to 325 mm2 or 580 mm2 per minute depending on write mode, while featuring excellent values for CD, image quality, overlay, and registration.

Key Features

  • Maximum substrate size: 9" x 9"; optional: 17" x 17"
  • Minimum feature size: 500 nm
  • Address grid down to 5 nm
  • High-speed optical engine
  • Customized UV optics (0.9 NA objective lens)
  • 20 nm line edge roughness
  • Input formats: All standard formats, e.g. GDSII, OASIS
  • Overlay of 30 nm
  • Economical, high-power UV laser
  • 100 nm 2nd layer alignment
  • Automatic mask loader
  • CD uniformity of 30 nm
  • SECS / GEM protocol
  • High-speed data path for all types of pattern

Application images

  

Circular structures

The ULTRA’s data path has been designed to be able to handle even complex geometries and dense patterns while upholding high exposure speed – even round or circular features can be written easily. The image shows rings with a line width of 600 nm.
Courtesy of HIMT

Lines and spaces

The image shows 500 nm tilted lines and spaces; a key element of major relevance to many applications like processors, printed circuits, and structures in photonics, for example optical grids.
Courtesy of HIMT

Downloads

Key technical specifications.

Fact sheet

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