MLA300

The Maskless Aligner for Volume Production

The MLA300 is the industrial production version of the Maskless Aligner, which already has become a standard in Research & Development applications, rapid prototyping, and low-to mid-volume production. The MLA300 achieves high resolutions of 2 µm lines and spaces at the high throughput and high availability expected in production. It features full automation with wafer robot and load ports, and software specifically designed for the production environment to offer a simplified automated workflow.

At the same time, it features all the advantages associated with maskless lithography: Overheads and expense associated with the procurement of masks, and their handling, cleaning, and storage are eliminated.

The Maskless Aligner technology uses a Spatial Light Modulator which essentially acts like a dynamic mask. It offers the flexibility to structure the most challenging substrates, allowing per-die pattern corrections (e.g. to react to distortions or process variations), and employs a real-time autofocus to follow substrate warp or corrugations. The fully integrated exposure modules are available for a selection of wavelengths (375 nm or 405 nm) and with different resolution options. Multiple exposure modules can be mounted in the MLA300 for even higher throughput.

The MLA300 excels in application areas such as the production of sensors, sensor ICs, MEMS devices, discrete electronic components, analog and digital ICs, ASICs, Power electronics, OLED displays, as well as for advanced packaging applications.

 

Key Features

  • Maximum exposure area: 300 mm x 300 mm
  • Minimum feature size: 1.5 μm
  • Minimum lines and spaces: 2 µm
  • Maximum write speed: 5000 mm2/min (at 405 nm, with one module)
  • Real-time autofocus
  • Overview camera for fast alignment and inspection
  • Front- and backside alignment
  • Temperature-controlled environmental chamber
  • Exposure wavelengths: 405 nm and / or 375 nm

Application images

  

MEMS

MEMS processes integrate standard microchip technologies with electromechanical components of a diverse range of sizes and materials. Stresses and stress-induced deformations need to be managed carefully to yield correct device properties. The Maskless Aligner technology is ideally suited to make on the fly corrections to the design if required.

Flexible or Challenging Substrates

Structuring flexible substrates is challenging as the shape and the distortions vary with applied forces. Maskless lithography offers the unique option of exposing the substrates with warpage-dependent pre-distortions, to maximise yield.

Sensors

Maskless lithography provides the extreme overlay accuracy which is central to applications in the sensor field: The production of SQUID devices may involve as many as 18 layers and high-resolution features. The alignment between layers is crucial to the production yield, and is completed automatically with the Maskless Aligner technology (impressively demonstrated here by the MLA150). SQUID image: Courtesy of the Kirchhoff Institute for Physics (KIP), Heidelberg University

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Key technical specifications.

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