Exposure of sprayed photoresist on KOH etched side walls of a silicon wafer with Heidelberg Instruments DWL 66+

Direct laser writing enables high-resolution patterning of sprayed photoresist on deep KOH-etched silicon sidewalls using the DWL 66+ and freeform exposure software.

File Type: pdf
Categories: Application Note
Tags: Direct Writing, DWL 66+
Author: Fraunhofer IMM, Heidelberg Instruments
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