Heidelberg Instruments’ Workshop on Maskless Lithography and Direct Write technology in Japan, hosted at The University of Tokyo’s Takeda Building. Source: The University of Tokyo.
We are excited to recap the second workshop on Maskless Lithography and Direct Write technology in Japan, hosted by The University of Tokyo on June 13, 2024. This event brought together experts and industry leaders to discuss the latest advancements and applications in these cutting-edge technologies.
With a warm welcome Dr. Akio Higo of D2T, The University of Tokyo, opened the workshop and set the stage for an insightful day of technical presentations and discussions on Maskless Lithography and Direct Write technologies.
The first technical talk was delivered by Dominique Collé, Technical Application Manager at Heidelberg Instruments, focusing on Grayscale/DWL 66+ and the MLA 150 Maskless Aligner. His presentation provided an in-depth look at the capabilities and applications of these advanced tools in microfabrication.
Dr. Akio Higo from The University of Tokyo then presented on ‘Micron-to-Submicron Cu electroplating in view of Agile-X LSI Chips Fabrication using Open Facility’. His talk highlighted the versatility and potential of this technique in achieving high-precision results.
Following the talk of Dr. Higo, Dr. Satoshi Shimizu from GenISys K.K. discussed the BEAMER software for DWL series. This session showcased the software’s functionality and its role in enhancing the accuracy and efficiency of laser direct writing processes.
The coffee break provided a valuable opportunity for networking, to exchange ideas, discuss collaborations, and build professional connections.
The technical talks resumed with Willi Mantei, Head of the Heidelberg Instruments TPP Process and Application Lab, presenting on Two-Photon Polymerization (TPP) technology and the MPO 100 system – multi-user tool for 3D Laser Lithography and 3D Microprinting. His talk covered various applications, demonstrating the technology’s versatility and effectiveness in different scenarios.
Fei Yang, Business Development Engineer at Heidelberg Instruments Nano, followed with a presentation on the NanoFrazor Nanolithography tool. In her talk she provided expert knowledge on Thermal Scanning Probe Lithography (t-SPL) and its applications. Fundamentally, the NanoFrazor employs an ultra-sharp, heatable probe tip capable of simultaneously writing and inspecting intricate nanostructures. Dr. Yukinori Ochiai from The University of Tokyo introduced the Takeda Clean Room, providing insights into its facilities and capabilities. This session underscored the importance of state-of-the-art clean rooms in supporting advanced research and development activities.
The workshop concluded with a wrap-up session, summarizing the key takeaways from the day, discussing future directions for research and collaboration in Maskless Lithography and Direct Write technology. We extend our heartfelt thanks to The University of Tokyo for kindly hosting this successful event! Thanks to all participants for the interest and active contributions.
For more information about the Nanotechnology Hub at The University of Tokyo, Takeda Cleanroom Facility: Takeda Clean Room
The Heidelberg Instruments systems and technology pool comprises high-precision Maskless Aligner (MLA) and Laser Lithography systems for Direct Writing of 2D, 2.5D and 3D microstructures to mask-making, and systems based on Thermal Scanning Probe Lithography (t-SPL) for the advanced nanopatterning. 3D laser lithography systems based on Two-Photon Polymerization (TPP) technology close the gap between conventional laser lithography – the basis of Heidelberg Instruments’ strong core business – and the Thermal Scanning Probe Lithography (t-SPL) for nanopatterning.
Maskless Lithography as the state-of-the-art, high-precision, highly flexible technology is ideal for use in both R&D as well as environments where rapid-prototyping of feature sizes greater than 1 µm are required. The maskless lithography technique enables you to transfer the design directly to the wafer without the need for a photomask.
In maskless lithography the pattern is exposed directly onto the substrate surface with the help of a spatial light modulator, or SLM, which serves as a “dynamic photomask”.
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