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March 2022

Heidelberg Instruments receives an order from an advanced wafer-level packaging provider in Asia

Heidelberg, March 30, 2022. Heidelberg Instruments has received a significant order from a leading semiconductor wafer-level packaging production company in Asia for its MLA 300 Maskless Aligner. With this order, Heidelberg Instruments has reached another important milestone towards the company’s goal of becoming a leading supplier of maskless lithography tools to the advanced wafer-level packaging

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MPO 100 Webinar Registration is Open

MPO 100 – Multi-User Tool for 3D Lithography and 3D Microprinting „1 – 10 – 100 – 1000” – Achievable component heights of over 1 cm, surfaces with roughness in the order of 10 nm, structure sizes of less than 100 nm, and writing speeds over 1000 mm/s: The new two-photon polymerization platform MPO 100

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EPIC Virtual Company Tour

EPIC Virtual Company Tour at Heidelberg Instruments and Multiphoton Optics The European Photonics Industry Consortium (EPIC), Multiphoton Optics and Heidelberg Instruments invite you to join us Tuesday, March 22nd from 4:00 pm – 5:00 pm (CEST) on Zoom for a live guided company tour. register Step inside our state-of-the-art facilities to meet our team and learn

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EPIC Virtual Company Tour

EPIC Virtual Company Tour at Heidelberg Instruments and Multiphoton Optics The European Photonics Industry Consortium (EPIC), Multiphoton Optics and Heidelberg

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Happy Holidays

Our best wishes for a healthy, prosperous New Year Thank you very much for your confidence and your co-operation in

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